High-speed data transmission system based on half-mode substrate integrated waveguide interconnection

Abstract

The invention discloses a high-speed data transmission system based on half mode substrate integrated waveguide (HMSIW) interconnection. The high-speed data transmission system comprises a modulation module, a HMSIW interconnection structure and a demodulation module. The modulation module modulates inputted binary signals, the demodulation module performs demodulation output on receiving signals, and the HMSIW interconnection structure serving as a system interconnection transmission channel has the modulation module and the demodulation module connected. The HMSIW structure is applied to the high-speed interconnection system of a microwave frequency band, the inputted binary signals are modulated and are transmitted through the HMSIW interconnection, the received signals are subjected to demodulation output, and high-speed data transmission is realized.

Description

technical field [0001] The invention relates to the technical field of half-mode substrate integrated waveguide (HMSIW), signal modulation and demodulation, and high-speed interconnection in microwave frequency bands, in particular to a high-speed data transmission system based on half-mode substrate integrated waveguide interconnection. Background technique [0002] In recent years, with the rapid development of communication technology, the research and development of microwave and millimeter wave communication devices and systems has attracted more and more attention. The operating frequency of digital signals has reached the millimeter wave frequency band, and the transmission rate required by a single interconnection line in the field of high-speed interconnection can reach more than 10Gbps. High-speed interconnection technology has become an important topic more and more. Realizing high-speed and low-consumption interconnection transmission between chips, circuit board...

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