IC card packaging device and method

A technology of packaging device and hot pressing device, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as bad sensory experience of users, shrinkage deformation, and affecting the appearance of the card surface

Active Publication Date: 2017-11-28
HONGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on the above reasons, it is necessary to provide a technical solution for IC card packaging to solve the problem that the plastic card base shrinks and deforms due to softening during the process of embedding the IC card chip into the card body of the plastic card base, resulting in the packaging of the IC card. There are obvious shrinkage marks on the back of the chip of the card, which seriously affects the aesthetics of the card surface, which in turn brings users a bad sensory experience.

Method used

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  • IC card packaging device and method
  • IC card packaging device and method
  • IC card packaging device and method

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Embodiment Construction

[0038] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0039] see figure 2 , is the IC card schematic diagram after encapsulation; Described IC card 9 comprises plastic card base 91 and IC card chip 92, from figure 2 It can be seen from the figure that when the chip is embedded in the card body of the plastic card base, it cannot completely fill the chip slot on the plastic card base, so there is still a certain space in the chip slot on the plastic card base below the IC card chip 92. Empty area 93. In this way, during the packaging process of the IC card, due to the existence of the avoidance area, the plastic card base is prone to shrinkage and deformation when it is cooled, which leads to the back of the packaged plastic card base (that is, the other side opposite to the chip side) on t...

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Abstract

The invention provides an IC card packaging device and method. The IC card packaging device includes a packaging platform, a hot pressing device, a cold pressing device, a negative pressure device, a transmission device and a power unit, and the hot pressing device and the cold pressing device are along the IC The card transmission direction is set in sequence, the hot pressing device includes a hot pressing head, and a heating device is arranged in the hot pressing head; the cold pressing device includes a cold pressing head, and a card slot matching the size of the IC card is provided on the packaging platform , the bottom surface of the card slot is provided with adsorption pores, and the negative pressure device communicates with the adsorption pores. When the cold pressure head cold-presses the IC card in the card slot, the adsorption pores absorb the plastic card base in the card slot with negative pressure, so that the lower surface of the plastic card base in the softened state becomes regular and flat, which greatly improves the The aesthetics of the card surface.

Description

technical field [0001] The invention relates to the field of IC card production and processing, in particular to an IC card packaging device and method. Background technique [0002] Since the promotion of IC cards, they have been popularized rapidly. Up to now, the number of IC cards issued has exceeded 1 billion, accounting for more than 80% of the total number of newly issued bank cards. In order to further increase the utilization rate of financial IC card chips and reduce the risk of counterfeit cards, according to the deployment of the central bank, IC cards will completely replace magnetic stripe cards from January 1, 2015. In this context, in the next few years, the demand for IC cards will continue to rise, and the production and processing of IC cards has a broad market prospect. [0003] In the process of IC production and processing, encapsulating IC cards is an important link. Existing IC cards generally include financial IC card chips and plastic card bases. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/50
Inventor 罗长兵陈晋杰高强刘源海
Owner HONGBO CO LTD
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