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A high-density integrated circuit packaging structure

An integrated circuit and packaging structure technology, applied in the field of high-density integrated circuit packaging structure, can solve problems such as insufficient technology and low reliability, and achieve the effects of improved electrical performance, good cost, and improved reliability

Active Publication Date: 2018-12-04
CHINA CHIPPACKING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] At present, domestic packaging factories still rarely have this kind of 208mil wide-body SOP8 packaging technology, even if there is, the technology is not perfect and the reliability is relatively low

Method used

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  • A high-density integrated circuit packaging structure
  • A high-density integrated circuit packaging structure
  • A high-density integrated circuit packaging structure

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Embodiment Construction

[0032] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0033] Such as figure 1 As shown, it is a schematic diagram of a high-density integrated circuit packaging structure of the present invention, including the outer pin 1 and the plastic package body 2, the length A1 of the plastic package body 2 satisfies the relationship 5.13mm≤A1≤5.23mm, and the width A2 of the plastic package body 2 satisfies The relationship 5.18mm≤A2≤5.38mm, the thickness A3 of the plastic package 2 satisfies the relationship 1.70mm≤A3≤1.90mm, the span B1 of the outer pin 1 satisfies 3.123mm≤B1≤5.123mm, and the span B1 of the outer pin 1 satisfies 7.70 mm≤B1≤8.10mm, the spacing B2 of the outer pin 1 satisfies 1.250mm≤B2≤2.540mm, the length B3 of the outer pin 1 satisfies B3=(B1-A2) / 2, that is, 1.26mm≤B3≤1.36mm, The sole A6 of the outer pin 1 satisfies 0.60mm≤A6≤0.70mm, and the width B4 of the outer pin 1 satisfies 0.38mm≤B4≤0.48mm; throu...

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Abstract

The invention discloses a high-density integrated circuit package structure which comprises a metallic lead frame formed by a lead frame basis, an inner lead pin and an outer pin. A chip is fixed on the lead frame basis, a micro connecting line is arranged between the chip and the inner lead pin, and the lead frame, the chip and the micro connecting line are sealed in a cuboid plastic-sealed body. The length A1 of the plastic-sealed body satisfies the relation of 5.13mm<=A1<=5.23mm, the width A2 of the plastic-sealed body satisfies the relation of 5.18mm<=A2<=5.38mm, and the thickness A3 of the plastic-sealed body satisfies the relation of 1.70mm<=A3<=1.90mm. The package structure is applicable to small and medium integrated circuits with special requirements on high frequency, high bandwidth, low noise and high heat conduction and electric conduction performance, and overcomes the defects that a conventional packaging structure is low in circuit integrated level, high in packaging cost and low in performance.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, in particular to a high-density integrated circuit packaging structure. Background technique [0002] Integrated circuit packaging not only plays the role of electrical connection between the bonding points in the integrated circuit chip and the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated circuit chip, so that the integration The circuit chip can perform normal functions and guarantee its high stability and reliability. In short, the quality of integrated circuit packaging has a great influence on the overall performance of integrated circuits. Therefore, the package should have strong mechanical properties, good electrical properties, heat dissipation performance and chemical stability. [0003] Although the physical structure, application...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/495
CPCH01L24/97H01L2924/181H01L2924/00012
Inventor 刘兴波周维宋波
Owner CHINA CHIPPACKING TECH
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