34 results about "Small scale integration" patented technology

The invention provides a blade server which comprises a chassis with the height of 10U. A middle plate is arranged in the chassis and provided with a front side part and a back side part, wherein the front side part of the middle plate is provided with 10 blades (20), 20 hard discs (8), two management modules (4) and a front-side switchboard module; and the back side part of the middle plate is connected with four fan modules (16), 20 PCI (Programmable Communications Interface) expansion cards (18), four power source modules (14) and six back-side switchboard modules. In the invention, through the arrangement way of each module (including the blades) in the front space and the back space of the chassis, the space of the chassis of the blade server can be fully utilized to correspondingly improve the computation intension and the data processing ability of the blade server. In addition, the blade is an SSI (Small Scale Integration) standard blade so as to be compatible with the SSI standard in a designing way, and the blade server also benefits the reduction of part cost.

The invention discloses an SSI (Small Scale Integration) data transmitter for a rotary encoder based on a CPLD (Complex Programmable Logic Device) / FPGA (Field Programmable Gate Array), which adopts the CPLD / FPGA as a basic hardware platform and mainly comprises an RD (Resistance discharge) controller, an SSI communication interface, an FIFO (First In First Out) and an RD decoder. The SSI data transmitter has the advantages that the characteristic information of the descending edge, the ascending edge, the high-low level duration time and the like of an SSI synchronous clock for the rotary encoder can be automatically detected; the absolute type parallel data of the angular displacement information output by a rotary transformer can be directly converted into the serial mode of the SSI interface for an industrial encoder to be transmitted; and the SSI data transmitter provides a new method for realizing the application of the SSI interface by the rotary encoder on industrial site.

The invention relates to a multichannel SSI (small scale integration) data collecting module based on a MicroBlaze soft core. The multichannel SSI data collecting module has the main technical characteristics that the multichannel SSI data collecting module comprises an SSI multichannel collecting unit and the MicroBlaze soft core arranged in an FPGA (field programmable gate array), wherein the SSI multichannel collecting unit consists of a register array and a data collecting unit, on one hand, the register array is connected with a CPU (central processing unit) through a PLB (processor local bus), on the other hand, the register array is connected with the data collecting unit, the data collecting unit is connected with an encoder through a signal wire and is used for collecting data of the encoder and transmitting the data to the register array, and the register array transmits the collected data to the CPU through the PLB. The multichannel SSI has the advantages that the data collecting and processing functions of multichannel encoders are realized through the SSI multichannel collecting unit and the MicroBlaze soft core arranged in the FPGA, the whole data collecting and processing processes can be respectively completed in the FPGA, and the data transmission path and the operation path are shortened, so the multichannel data collecting speed is accelerated, and the problems of slow data collecting process and long operation period are solved.

The invention discloses a digital circuit experiment device and experiment method. The digital circuit experiment device comprises an FPGA chip which is in communication with an upper computer and placed in an experiment box, connecting wires between pins of the FPGA chip and pins of IC sockets are achieved through wiring of a PCB, the FPGA chip is connected with the multiple IC sockets, and a power source of the IC sockets and the ground are connected with a corresponding power source for supplying power to the experiment box and the ground respectively. Due to switching on and switching off of a switch arranged in a switch circuit, various data are input into an integrated circuit, and various corresponding data output by the integrated circuit are displayed on a display circuit. Interference, error wire connection and poor contact caused by chaos wire connection of metal wires can be avoided. The small-scale integrated circuit of the digital circuit experiment box is reserved, and a beginner can establish the logic circuit concept easily. The wire connection relation of a conducted experiment can be reserved for the upper computer, and convenience is provided for repeatedly verifying the experiment and completing a half-finished experiment.

The invention relates to an integral positive and negative continuous linear adjustable high voltage output power supply circuit which comprises a control voltage linear conversion circuit and a positive and negative high voltage output automatic switching circuit. The control voltage linear conversion circuit is connected with the positive and negative high voltage output automatic switching circuit. The integral positive and negative continuous linear adjustable high voltage output power supply circuit provided by the invention has the advantages that high voltage output is continuously and linearly adjustable from negative to positive or from positive to negative; the output precision is high; positive and negative high voltage output and external control terminal voltage have great corresponding linearity; the remote control precision is effectively improved; the accuracy of follow-up data statistics and analysis is improved; and the requirements of small-scale integration and automation remote control are met.

The invention relates to a micro broad-pulse dual-wavelength optogenetic stimulation device which comprises a small-scale integrated circuit, semiconductor light-emitting devices and switch type driving circuits, wherein the small-scale integrated circuit is respectively connected with two adjustable resistors capable of independently adjusting pulse parameters within large ranges, a changeover switch and an electrical interface; the electrical interface is used for monitoring pulse waveforms and parameters; both ends of the changeover switch are respectively connected with the switch type driving circuits; the two switch type driving circuits are respectively connected with one semiconductor light-emitting device; light pulses of two wavelengths, which are sent out by the driven semiconductor light-emitting devices, are respectively coupled to a light output interface through an optical fiber to be output or are directly output by the optical fiber; and the small-scale integrated circuit is connected with a power supply through a micro voltage-stabilizing module. The invention is applicable to light-emitting diodes (LED) and laser diodes (LD), can be applied to laser diode-pumpedsolid or optical fiber lasers, has fine universality and generality, and can be implemented in a flexible mode.

The invention discloses a universal electronic potentiometer module. Functional circuits such as a key switch, a square generator, an accelerating circuit, a keystroke distinguishing circuit, a counter, an NPN-typed triode array with the collector open and a resistance network and the like are electrically connected to form a complete electronic potentiometer apparatus which outputs a passive power to realize the function of a common potentiometer and expand new functions. The invention has a resistance output mode and a voltage output mode, can also lead an output value to be passively adjusted or reversely adjusted; the modes and functions can lead the module to be very easily and directly connected with other various external active circuits, and are broadly applied to various electronic fields. The technical principle construction realizing method of the invention is as follow: 1) using separated elements and small scale integrated circuits; 2) using the singlechip like AT89C2051 as a core; 3) integrating the function components and elements which can be integrated.

The invention discloses a high-density integrated circuit package structure which comprises a metallic lead frame formed by a lead frame basis, an inner lead pin and an outer pin. A chip is fixed on the lead frame basis, a micro connecting line is arranged between the chip and the inner lead pin, and the lead frame, the chip and the micro connecting line are sealed in a cuboid plastic-sealed body. The length A1 of the plastic-sealed body satisfies the relation of 5.13mm<=A1<=5.23mm, the width A2 of the plastic-sealed body satisfies the relation of 5.18mm<=A2<=5.38mm, and the thickness A3 of the plastic-sealed body satisfies the relation of 1.70mm<=A3<=1.90mm. The package structure is applicable to small and medium integrated circuits with special requirements on high frequency, high bandwidth, low noise and high heat conduction and electric conduction performance, and overcomes the defects that a conventional packaging structure is low in circuit integrated level, high in packaging cost and low in performance.