High-density integrated circuit package structure
A technology of integrated circuit and packaging structure, which is applied in the field of high-density integrated circuit packaging structure, can solve the problems of insufficient technology and low reliability, and achieve the effects of improved electrical performance, good cost and improved reliability
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[0032] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0033] Such as figure 1 As shown, it is a schematic diagram of a high-density integrated circuit packaging structure of the present invention, including the outer pin 1 and the plastic package body 2, the length A1 of the plastic package body 2 satisfies the relationship 5.13mm≤A1≤5.23mm, and the width A2 of the plastic package body 2 satisfies The relationship 5.18mm≤A2≤5.38mm, the thickness A3 of the plastic package 2 satisfies the relationship 1.70mm≤A3≤1.90mm, the span B1 of the outer pin 1 satisfies 3.123mm≤B1≤5.123mm, and the span B1 of the outer pin 1 satisfies 7.70 mm≤B1≤8.10mm, the spacing B2 of the outer pin 1 satisfies 1.250mm≤B2≤2.540mm, the length B3 of the outer pin 1 satisfies B3=(B1-A2) / 2, that is, 1.26mm≤B3≤1.36mm, The sole A6 of the outer pin 1 satisfies 0.60mm≤A6≤0.70mm, and the width B4 of the outer pin 1 satisfies 0.38mm≤B4≤0.48mm; throu...
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