Plasma subcritical/supercritical fluid generator and abrasive water jet cutting head comprising generator

Abstract

The purpose of the invention is to provide a plasma subcritical/supercritical fluid generator and an abrasive water jet cutting head comprising the generator. The plasma subcritical/supercritical fluid generator comprises a protrusion electrode and an annular electrode, wherein the protrusion electrode and the annular electrode are connected through an insulation sealing ring; an electrode protrusion is formed in the middle of the protrusion electrode; holes are formed in the periphery of the electrode; a central hole is formed in the middle of the annular electrode; the electrode protrusion is opposite to the central hole; the protrusion electrode and the annular electrode are connected to a power supply; fluid flows into the generator through the holes at the periphery of the protrusion electrode and flows out of the generator through the central hole of the annular electrode; or the fluid flows into the generator through the central hole of the annular electrode and flows out of the generator through the holes at the periphery of the protrusion electrode; the electrode protrusion emits plasma beams, and the plasma beams pass through the fluid and then enter the annular electrode; or the annular electrode emits plasma beams, and the plasma beams pass through the fluid and then enter the protrusion electrode. By generating the plasma beams in the fluid, the inside of the generator is heated; the generator is applicable to small-scale integration and can be widely used in all systems and devices which need to generate subcritical/supercritical fluids.

Description

technical field [0001] The invention relates to a fluid generator and a cutting head containing the fluid generator. Background technique [0002] Supercritical fluids are widely used, such as silicon wafer cleaning systems, water jet cleaning systems and devices, etc. However, traditional supercritical fluid generators mostly use external heating. Patent CN102211096B proposes a supercritical water jet silicon wafer cleaning equipment, which uses external heating to heat the fluid in the pipeline to form a supercritical fluid; patent US20080060493A1 proposes a method of heating the inside of the pipeline using resistance or inductance to generate Supercritical fluid for abrasive water jet machining. It can be seen that the traditional supercritical fluid generation method has low thermal efficiency and large volume, which is not suitable for small-scale system integration. Contents of the invention [0003] The object of the present invention is to provide a plasma subcr...

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Problems solved by technology

It can be seen that the traditional supercritical fluid generation method has low therm

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