Shielding and grounding foam tape with metal foil as base material and preparation method thereof

A metal foil, substrate technology, used in adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., to achieve high electrical conductivity, excellent electromagnetic shielding function, and excellent three-dimensional electromagnetic shielding function. Effect

Active Publication Date: 2018-01-05
SHENZHEN MEIXIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] In order to solve the technical problems of the existing conductive foam tape, the present invention provides a shielding and grounding conductive foam tape with a metal foil base material and a preparation method thereof

Method used

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  • Shielding and grounding foam tape with metal foil as base material and preparation method thereof

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Embodiment Construction

[0025] Below in conjunction with example the present invention is described in further detail.

[0026] Such as figure 1 As shown, the embodiments of the present invention provide a shielding and grounding system based on metal foil

[0027] Conductive foam tape, which includes shielding and grounding conductive foam 1, hot melt adhesive 2, metal foil substrate 3, conductive adhesive layer 4, and release material layer 5, which are stacked sequentially from top to bottom.

[0028] In this embodiment, the metal foil substrate 3 can be selected from one of rolled copper foil, electrolytic copper foil, aluminum foil or aluminum foil / copper foil composite material with vertical conduction performance with different thicknesses having excellent electromagnetic shielding effect. The shielding and grounding conductive foam 1 has a thickness ranging from 0.2mm to 5.0mm, and the surface of the shielding and grounding conductive foam is vacuum-plated with metal materials. Compared wit...

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Abstract

The invention discloses a shielding and grounding conductive foam adhesive tape with metal foil as the base material, which comprises: shielding and grounding conductive foam, a hot melt adhesive layer, a metal foil base material, Conductive adhesive layer, release material layer. Also disclosed is a preparation method of a shielding and grounding conductive foam tape, which has high conductivity, better electromagnetic shielding function, better die-cutting, and less There will be fuzz problems similar to conductive cloth. Compared with using ordinary conductive pressure-sensitive adhesive to bond the foam to the substrate, the foam has better resilience, which solves the problem of poor rebound when the foam is stuck by the glue during die-cutting or use.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to an all-round conductive foam adhesive tape with metal foil as a base material and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the physical size of integrated circuits has been gradually reduced. The continuous improvement of integration and the widespread use of more conductive materials make electrostatic discharge and electromagnetic shielding increasingly important, so that the problems of electrostatic protection and electromagnetic shielding are also receiving more and more attention. Conductive foam tape is a composite of foam base and conductive material for EMI shielding with large fill gaps or tolerances. The foam's elasticity and consistency make it ideal for applications requiring low closure force and minimal compression set. Conductive foam tape can play the role of shock absorption, electromagnetic shielding, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/28C09J9/02C09J133/00C09J11/04
Inventor 陆兰硕洪文洲林学好
Owner SHENZHEN MEIXIN ELECTRONICS
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