A Piezoelectric Series Plunger Jet Dispensing Device

Abstract

The present invention relates to a dispensing device, in particular to a piezoelectric tandem plunger jet dispensing device, which includes a glue supply system and an injection system, and the piezoelectric tandem plunger jet dispensing device also includes a driver for sending a driving signal, The glue supply system includes a first spring, a first cavity, a first preload nut, a first piezoelectric stack and a first plunger, and the injection system includes a second spring, a second cavity, a second preload nut, a first Two piezoelectric stacks, a second plunger, a glue seat and a nozzle. The second plunger of the present invention has only an impact force on the glue, and will not collide with the nozzles to crush the glue particles sandwiched between the nozzles. At the same time, it will not cause serious damage to the nozzles due to collisions with the nozzles, which greatly prolongs the piezoelectricity. The service life of the tandem plunger jet dispensing device reduces maintenance costs, realizes the digital adjustment of the piezoelectric tandem plunger jet dispensing device, and greatly improves work efficiency.

Description

technical field [0001] The invention relates to a dispensing device, in particular to a piezoelectric serial plunger jet dispensing device. Background technique [0002] Dispensing device is a process equipment widely used in the field of product production, from semiconductor packaging industry, integrated circuit industry, SMT / PCB assembly industry to general industrial welding, injection coating and sealing, through this device to realize the dispensing of glue , line, surface sizing process. In the microelectronic packaging industry, in order to adapt to the irregularities of workpieces and pursue high-quality, high-speed, and high-precision fluid dispensing devices, dispensing technology has gradually developed towards non-contact jet dispensing. [0003] At present, the non-contact jet dispensing device uses the direct impact method to eject the glue, that is, the firing pin directly hits the nozzle under the drive of external force and ejects the glue between the fir...

AI Technical Summary

Problems solved by technology

[0003] At present, the non-contact jet dispensing device uses the direct impact method to eject the glue, that is, the firing pin directly hits the nozzle under the drive of external force and ejects the glue between the firing pin and the nozzle, and the direct contact between the firing pin and the nozzle The impact will cause serious wear of the nozzle, which greatly increases the maintenance cost of the non-contact jet dispensing device, and for glue with particles, such as solder paste, silver glue, etc., when the high-speed moving needle touches the valve seat, it will be caught The particles in between will be crushed, resulting in changes in the properties of the liquid, which limit the widespread use of non-contact jet dispensing devices

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