Circuit board transplantation double-sided automatic alignment device
An automatic alignment and alignment device technology, applied in the field of PCB board manufacturing, can solve the problems of low single alignment accuracy, and achieve the effects of stable operation, reduced error, and improved accuracy
Inactive Publication Date: 2016-06-22
HUAIAN ZIRANXING ELECTRONICS CO LTD
View PDF5 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The invention solves the problem of low single-sided alignment accuracy, improves the transplanting accuracy of existing machines by using the double-sided alignment mode, and adds the function of detecting board expansion and contraction at the same time
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0014] The present invention is a double-sided automatic alignment device for circuit board transplantation. The whole device includes a frame 2 , an operating platform 3 , a PCB board automatic alignment system 1 , an industrial computer 4 and a display 5 . The automatic alignment system 1 of the PCB board includes a CDD optical monitoring system 6 and a deviation correction alignment system 7; the CDD optical monitoring system 6 includes an A-side CDD optical monitoring camera 8 and a B-side CDD optical monitoring camera 9; The bit system 7 includes an optical scale 10, four sets of motors 11 for independent movement of X and Y axes, a lead screw 12, a mechanical arm 13 connected to an industrial computer, and a suction cup 14; The monitoring cameras 9 are respectively located on the upper and lower sides of the operating platform, and capture the position information of the optical points on the sub-board and the main board, combined with the data fed back by the optical sca...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The existing transplantation technology on the market has the shortcomings that a circuit board is likely to be scrapped and the precision in transplantation process is low because situations such as deviation occurred during the process of motherboard expansion and shrinkage as well as daughter board movement cannot be detected. The invention relates to a circuit board transplantation double-sided automatic alignment device, which solves the situation of low single-side alignment precision, improves the existing machine transplantation precision by utilizing a double-sided alignment mode, and adds a function of detecting board expansion and shrinkage. For a board having deviation within an error range, positions of optical points on daughter boards and a motherboard are captured by utilizing two high-precision cameras arranged above and below a tableboard, the positions are combined with data fed back by an optical scale, a movement path is calculated through calculation by a program in a computer, and a signal is sent out for driving a motor and a lead screw to drive a mechanical arm to achieve operational requirements.
Description
technical field [0001] The invention relates to the field of PCB board manufacturing, in particular to a PCB board auxiliary device. Background technique [0002] In the process of PCB board production, the appearance of multiple independent sub-pieces is a normal way to improve production efficiency. However, when this efficient production method is used, since multiple independent sub-pieces are connected in series, it is easy for a certain sub-piece to be scrapped. If the whole piece is scrapped, it will inevitably damage other good-quality sub-pieces. [0003] Such as figure 1 As shown, there are 3 sub-boards arranged together on the motherboard, and the 3 sub-boards are numbered 01, 02, and 03. The motherboard is tested to see if it is an OK board, and the motherboard that is an OK board flows into the client. The problematic motherboard may only have a problem with one of the sub-boards, such as 02, which requires cutting off 02 and filling it with an OK sub-board. ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H05K3/36
CPCH05K3/36H05K2203/166
Inventor 蔡忠安王少东
Owner HUAIAN ZIRANXING ELECTRONICS CO LTD