High-temperature melt physical property measuring device
A technology for measuring devices and high-temperature melts, applied in measuring devices, fluid resistance measurements, specific gravity measurements, etc., can solve problems such as high melting point of melts, silicon-molybdenum heating elements that cannot meet the requirements, troublesome replacement, etc., to achieve simple operation and reduce Experimental error and cost of experiment, effect of reliable data
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2016-06-29
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Abstract
Description
technical field
[0001] The invention belongs to a measuring device, in particular to a measuring device for high-temperature melt physical properties. Background technique
[0002] Viscosity, density and surface tension of high temperature melt are three very important parameters of high temperature melt. Electrical conductivity is an important parameter for electric furnace smelting. At present, the rotation method is used to measure the viscosity tester at home and abroad. The heating element of the tester is a heating electric furnace made of silicon molybdenum material. The maximum working temperature is 1450°C and 1600°C, and the temperature is controlled by a PID computer program. Measure the viscosity (spinning column extraction method), surface tension (pulling cylinder method) and density (Archimedes method) of high-temperature melts. The equipment basically meets the comprehensive test of high temperature melt physical properties, and the viscosity measurement ra...
Examples
Embodiment Construction
[0060] In describing the present invention, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer" etc. indicate an orientation or position The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be construed as a limitation of the present invention.
[0061] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In...