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strip adhesive film

A technology for bonding films and strips, applied to film/sheet-shaped adhesives, adhesives, instruments, etc., to achieve high processing efficiency and suppress quality deviations

Active Publication Date: 2021-07-13
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to realize these demands industrially and commercially, it is desirable to manufacture image display devices and / or their components at an acceptable cost, however, there are still various issues that should be reviewed in order to establish such a technology

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] A long laminate (width: 1200 mm, length: 43 m) having a composition of ester-based film (38 μm in thickness) / adhesive layer (5 μm in thickness) / separator (25 μm in thickness) was prepared. A carrier film (width: 1200 mm, length: 43 m) having a composition of an ester film (thickness: 38 μm) / adhesive layer (thickness: 5 μm) was bonded to the ester film surface of the laminate by roll-to-roll to produce a tape carrier Laminates of thin films.

[0107] Next, a cutting blade with a depth of 80 μm was cut into the laminate with a carrier film from the separator surface using a punching device, and half-cut into a circular shape with a diameter of 2.4 mm so as not to pass through the carrier film. Half cutting is performed at intervals of 250 mm in the length direction and at intervals of 400 mm in the width direction.

[0108] Next, the carrier film was peeled off from the laminate to obtain an adhesive film.

Embodiment 2

[0110] In addition to using a laser cutting machine (CO 2 An adhesive film was obtained in the same manner as in Example 1, except that a laser, wavelength: 9.4 μm, output: 10 W) was used instead of a punching device for half-cutting (cutting depth: 80 μm).

[0111] The following evaluations were performed for each Example.

[0112] 1. Perforated waste

[0113] Confirm that the perforation waste caused by cutting is removed when the carrier film is peeled off.

[0114] 2. Adhesive appearance of the adhesive film

[0115] The separator was peeled off, the adhesive film was bonded to a commercially available polarizer, and its appearance was observed with a microscope.

[0116] In various embodiments, the perforation waste generated by half-cutting is completely removed when the carrier film is peeled off.

[0117] The obtained adhesive film is attached to the polarizer and the bonding state of the polarizer and the adhesive film is observed, the results are as follows: Fi...

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Abstract

The present invention provides a long adhesive film that can be suitably used as a surface protection film or a mask when processing a predetermined portion of a long film. The elongated adhesive film of the present invention has an elongated resin film and an adhesive layer provided on one side of the resin film, and has integrally penetrated adhesive layers arranged at predetermined intervals in the longitudinal direction and / or width direction. The resin film and the through hole of the adhesive layer.

Description

technical field [0001] The present invention relates to a long adhesive film. More specifically, the present invention relates to a long adhesive film having through holes arranged in a predetermined pattern. Background technique [0002] Some image display devices such as mobile phones and notebook personal computers (PCs) are equipped with internal electronic components such as cameras. Various studies have been conducted for the purpose of improving the camera performance of such an image display device (for example, Patent Documents 1 to 7). However, with the rapid spread of smart phones and touch panel-type information processing devices, further improvements in camera performance and the like are expected. In addition, in order to cope with the diversification of shapes and higher functionality of image display devices, a polarizing plate having partial polarizing performance is required. In order to realize these demands industrially and commercially, it is desirab...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B5/30C09J7/20
CPCC09J2203/318C09J7/20G02B5/3033C09J2301/18C09J2301/302G02B1/14
Inventor 尾込大介八重樫将宽中野勇树仲井宏太大濑雄基
Owner NITTO DENKO CORP