Preparation method for die surface polishing device

A surface polishing and polishing device technology, applied in the direction of grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve problems such as low efficiency and inability to meet production needs, so as to improve production efficiency, reduce human labor, and facilitate The effect of moving

Pending Publication Date: 2017-05-31
TIANJIN LIDELI TECH DEV CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The problem to be solved by the present invention is that at present, the mold polishing machine used in the background technology can only polish one mold, the efficiency is very low, and it can no longer meet the production needs

Method used

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  • Preparation method for die surface polishing device

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Embodiment Construction

[0023] Such as figure 1 As shown, a preparation method of a mold surface polishing device includes a control box 1, a support device and a polishing device, the support device includes a fixed frame 4, a template seat 5 and a top plate 11, and one side of the control box 1 is provided with There is a top plate 11, a fixed frame 4 is arranged above the top plate 11, and a template seat 5 is arranged in the fixed frame 4;

[0024] Described polishing device comprises operating frame 7, elevating rod 9 and grinder 10, and described operating frame 7 is located at above fixed mount 4 and its one end is installed on the control box 1, and described operating frame 7 is provided with lifting Rod 9, the lower end of the lifting rod 9 is provided with a sharpener 10.

[0025] One end of described fixed frame 4 is provided with fixed plate 6, and described fixed plate 6 is provided with guide groove, and the other end of described operation frame 7 is installed in the guide groove, an...

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Abstract

The invention provides a preparation method for a die surface polishing device. The die surface polishing device comprises a control box, a support device and a polishing device, wherein the support device comprises a fixed frame, a die plate seat and a top plate, the top plate is arranged at one side of the control box, the fixed frame is arranged above the top plate, and the die plate seat is arranged in the fixed frame; and the polishing device comprises an operation frame, a lifting rod and a grinding tool, the operation frame is arranged above the fixed frame and one end of the operation frame is installed on the control box, the lifting rod is arranged on the operation frame, and the grinding tool is arranged at the lower end of the lifting rod. The die plate seat in the invention is capable of rotating in the fixed frame under the driving of a rotary shaft, so that convenience is provided for machining for the other surface, the steps of replacing the die plate seat and overturning are reduced, the machining time is shortened, the labour amount is reduced, and the production efficiency is increased.

Description

technical field [0001] The invention relates to a preparation method of a mold surface polishing device. Background technique [0002] For molds, the last key process of making and repairing is polishing, and the surface finish of the mold working area directly affects the surface quality of the product. At present, the mold polishing machine used in the background art can only polish one mold, and the efficiency is very low, which cannot meet the production needs. If it is combined with manual polishing, the polishing effect is far inferior to mechanical polishing, and the mold has a short service life and frequent maintenance, which reduces the production efficiency of the workshop and affects product quality. Contents of the invention [0003] The problem to be solved by the present invention is that at present, the mold polishing machine used in the background technology can only polish one mold, and the efficiency is very low, which cannot meet the production needs. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/20B24B41/06
CPCB24B19/20B24B41/06
Inventor 赵健刚赵建辉刘华敏刘金鸣齐德浩玄国
Owner TIANJIN LIDELI TECH DEV CO LTD
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