Waterproof packaging structure and packaging method of large-dimensional photomultiplier

Abstract

The invention discloses a waterproof packaging structure and a packaging method of a large-dimensional photomultiplier. The waterproof packaging structure comprises a tray matched with the bottom shape of a glass shell of the photomultiplier, a sleeve, a cable waterproof connector and a bottom cover, wherein a hole is formed in the tray; the bore diameter of the hole is consistent to the inner diameter of the sleeve; the tray is connected with one end of the sleeve in a sealing manner through the hole; the other end of the sleeve is fixedly connected with the bottom cover; the tray and the bottom of the glass shell of the photomultiplier are connected in a sealing manner; and one end of the cable waterproof connector is connected with the cable inlet of the sleeve in a sealing manner while the other end is connected with a cable. According to the waterproof packaging structure and the packaging method, the packaging steps are less and the demand on an operator is relatively low; and more importantly, the waterproof packaging structure can be detached, so that problem checking and changing and upgrading of a PMT voltage divider can be realized.

Description

[0001] Technical field: [0002] The invention relates to a waterproof packaging method for a photomultiplier tube, in particular to a waterproof packaging structure and a packaging method for a large-scale photomultiplier tube. [0003] Background technique: [0004] The traditional photomultiplier tube waterproof packaging method generally adopts the "bubble seal" method, that is, the use of thermoplastic tubes and waterproof putty to wrap and waterproof the outer glass shell of the photomultiplier tube pole, and the photomultiplier tube voltage divider part is fixed by a plastic shell. Use insulating glue such as polyurethane or silica gel for potting, and the cable part is wrapped and waterproofed with thermoplastic tubes and waterproof putty. [0005] There are three aspects of prior art disadvantages: [0006] 1. The process is complex [0007] The "blister sealing" method has many process steps and is very dependent on manual processes. [0008] 2. Higher cost [000...

AI Technical Summary

Problems solved by technology

[0006] 1. The process is complex

[0007] Using the "blister sealing" method, there are many process steps, and it is very dependent on manual process

[0008] 2. Higher cost

[0009] More types of materials are used, which increases the cost

[0010] 3. Cannot be disassembled,

[0011] With the "blister sealing" method, once the PMT has a problem, it cannot be repaired and disassembled, and the PMT cannot be upgraded by replacing the voltage divider.

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