2results about How to "Reduce packaging steps" patented technology

This invention provides a glass substrate optoelectronic co-packaging structure and its fabrication method, addressing the technical problems of existing glass substrate-based optoelectronic co-packaging structures, such as easy mounting errors during assembly, poor structural stability, and easy displacement relative to the glass substrate during operation, resulting in transmission loss. The glass substrate optoelectronic co-packaging structure of this invention innovatively embeds optoelectronic integrated chips and integrated circuit chips within the glass substrate, and also incorporates a microbridge structure and a pluggable fiber array within the glass substrate. This not only reduces the overall volume of the packaging structure but also effectively improves the structural stability of each component, reducing failures caused by poor packaging or component detachment, and increasing packaging yield. More importantly, this design effectively ensures alignment accuracy, enabling precise docking between the optoelectronic integrated chip and the external optical signal array, achieving efficient and low-loss transmission of optical signals.

The utility model discloses a kind of packaging structures, applied to semiconductor technical field, comprising: photoelectric sensing chip and glass substrate;The upper surface of photoelectric sensing chip is provided with photosensitive area, and at least two first pads around photosensitive area;First pad surface is provided with conductive bump;Glass substrate is set on the upper surface of photoelectric sensing chip;Glass substrate lower surface is provided with rewiring layer;Rewiring layer includes at least two second pads around photosensitive area;And glass substrate is also provided with solder ball electric contact with second pad;Photoelectric sensing chip is electrically connected by conductive bump, second pad and solder ball.The utility model packaging thickness is small, heat dissipation performance is good, reliability is high, and cost is low.