30results about How to "Reduce packaging steps" patented technology

The invention discloses a highly thixotropic LED jelly glue for preventing fluorescent powder from settling. In the present invention, by optimizing the coupling agent and optimizing the hydrolysis conditions, the fumed silicon dioxide is modified to obtain a thixotropic material, and the fluorescent powder is modified to obtain an anti-sedimentation fluorescent powder. Add thixotropic materials to the silica gel system to obtain a highly thixotropic silica gel system with a thixotropic index of up to 5; adding different types and different contents of modified phosphors to the system can integrate jelly gels with different color temperatures. There will be no sedimentation during the 3-month warranty period, and the color temperature value will remain unchanged after packaging. The jelly glue of the present invention is packaged in a syringe without mold assistance, can be directly fixed on a glue dispensing machine for use, and is automatically formed after dispensing. The invention combines the fluorescent powder and the silica gel system to prepare the jelly glue, which can save the mold packaging step in the LED packaging link, simplify the downstream packaging process, shorten the production cycle, improve the production efficiency, and have good application prospects.

The invention relates to an encapsulation structure of a conductor frame without external pins. The encapsulation structure comprises a conductor frame without external pins, a chip and encapsulation material. The conductor frame without external pins consists of a framework and a chip seat. The framework is provided with a plurality of guiding and connecting parts, and a first depression part is arranged in the inner side part of the guiding and connecting parts. The chip seat is provided with a second depression part which is formed around the chip seat. The second depression part of the invention can inhibit problems like pollution and uneven surface caused by overflow of resin when the chip is arranged on the chip seat. Furthermore, the encapsulation structure of the invention requires no use of pad higher plates arranged between the chip and the chip seat, so as to reduce encapsulation steps and manufacturing cost.

The invention provides an integrally cut and impressed double-layer packaging box which comprises a box body and a box cover. An upper inner box body and a drawer-type lower inner box body are arranged in the box body. A box holder is placed in the upper inner box body and / or the lower inner box body. The upper surface of the box holder is provided with box slot impressing marks. The invention further provides an anti-counterfeit packaging method. The anti-counterfeit packaging method comprises the steps that the box body and the box cover are manufactured at first; then the box holder is manufactured, and the box slot impressing marks are formed on the upper surface of the box holder through a mold in cutting and impressing modes; anti-counterfeit ink is printed on the box slot impressingmarks, and an article box is put on the box holder before the anti-counterfeit ink is dry, and is pressed down after the anti-counterfeit ink is completely dry, so that a box slot is formed, and finally the article box sinks into the box slot; and finally packaging is conducted. The integrally cut and impressed double-layer packaging box is novel in structure and can be manufactured through simple technical steps, the manufacturing cost is reduced, the box can be used for anti-counterfeit packaging at the same time, and the value of non-commercial behavior recycling can be improved.

The invention discloses a packaging device capable of packaging multiple bundles of cables. The packaging device comprises a rack, a swing rod is connected to the upper left end of the rack in a swinging mode, a rotating shaft is rotationally connected to the left end of the swing rod, a connecting rod is hinged to the lower end of the swing rod, a sliding block is hinged to the right end of the connecting rod, and the sliding block is rotationally connected to a driven lead screw; and the left end of the driven lead screw is rotationally connected to the rack, the right end of the driven leadscrew is fixedly connected with a driven bevel gear, the driven bevel gear is engaged and connected with a driving bevel gear, the lower end of the driving bevel gear is fixedly connected with a driving shaft, the lower end of the driving shaft is fixedly connected with a right belt wheel, and the lower left end of the rack is fixedly connected with a motor box. By means of the packaging device,the multiple bundles of cables can be placed at the same time, and all the placed cables are packaged into a barrel shape, so that the packaging steps are reduced, the efficiency and the packaging speed are improved, the packaging cloth can be automatically cut off in a fixed-length mode, and waste caused by excessive packaging is reduced.

The invention discloses a packaging structure of a UVLED lamp, which includes a fixing frame and a mounting frame, and relates to the technical field of UVLED lamps. The packaging structure of the UVLED lamp is connected by connecting the docking slider of the previous UVLED lamp with the docking slide rail of the latter UVLED lamp, and at the same time moving the slider of the latter UVLED lamp to the top of the first slide rail. When the positioning block inside a UVLED lamp moves to the position of the positioning hole inside the previous UVLED lamp, the elastic force of the spring will move the positioning block to the inside of the positioning hole, and then slide the slider of the latter UVLED lamp from the top of the first slide rail Move down and cover the second rail of the previous UVLED lamp on the inside of the slider, so that multiple UVLED lamps can be connected together.

The invention relates to a preparation method of a three-dimensional paper chip, in particular to a preparation method of a novel magnetic self-assembled three-dimensional paper chip. The preparationmethod comprises the following steps: with hydrophobic magnetic ink, carrying out screen printing to obtain a channel layer, a pretreatment reagent layer and a detection layer of the paper chip separately; printing a pretreatment agent on the pretreatment reagent layer with a squeegee through patterned reagent printing silk screen; printing a detection agent in a detection area on the detection layer with a squeegee through the patterned reagent printing silk screen; and stacking the channel layer, the pretreatment reagent layer and the detection layer in sequence on a pad made of a magnetic material, so as to obtain the three-dimensional paper chip. The preparation method of the novel magnetic self-assembled three-dimensional paper chip provided by the invention adopts a screen printing technology, an additional bonding layer or a glue spraying or printing step is avoided by improving a printing material, and a magnetic material and a hydrophobic material are both used for printing tosimplify the preparation steps and eliminate the risk that glue permeates to block hydrophilic channels.

The invention discloses a concentrating photovoltaic solar device. The concentrating photovoltaic solar device comprises a reflecting mirror structure (2), a photovoltaic cell device (6), a radiator (11) and a cover lens (5), wherein the reflecting mirror structure (2) comprises a reflecting mirror (3); the photovoltaic cell device (6) is respectively arranged on the special position of the reflecting mirror structure (2) for directly receiving light rays converged by the corresponding reflecting mirror (3); the arranged position of the radiator (11) does not affect a reflecting light path, and is close to or partly superposed with the reflecting mirror structure (2); the cover lens (5) is arranged in front of the reflecting mirror structure (2), wherein the reflecting mirror structure (2) and the cover lens (5) form a closed space; and the photovoltaic cell device (6) is arranged in the closed space. The concentrating photovoltaic solar device has reliable performance, is high in strength, low in cost and long in service life, and can be installed in the form of an array, and can be applied in a large-scale manner.

The invention discloses a waterproof packaging structure and a packaging method of a large-dimensional photomultiplier. The waterproof packaging structure comprises a tray matched with the bottom shape of a glass shell of the photomultiplier, a sleeve, a cable waterproof connector and a bottom cover, wherein a hole is formed in the tray; the bore diameter of the hole is consistent to the inner diameter of the sleeve; the tray is connected with one end of the sleeve in a sealing manner through the hole; the other end of the sleeve is fixedly connected with the bottom cover; the tray and the bottom of the glass shell of the photomultiplier are connected in a sealing manner; and one end of the cable waterproof connector is connected with the cable inlet of the sleeve in a sealing manner while the other end is connected with a cable. According to the waterproof packaging structure and the packaging method, the packaging steps are less and the demand on an operator is relatively low; and more importantly, the waterproof packaging structure can be detached, so that problem checking and changing and upgrading of a PMT voltage divider can be realized.