1results about How to "Reduce packaging steps" patented technology

This invention provides a glass substrate optoelectronic co-packaging structure and its fabrication method, addressing the technical problems of existing glass substrate-based optoelectronic co-packaging structures, such as easy mounting errors during assembly, poor structural stability, and easy displacement relative to the glass substrate during operation, resulting in transmission loss. The glass substrate optoelectronic co-packaging structure of this invention innovatively embeds optoelectronic integrated chips and integrated circuit chips within the glass substrate, and also incorporates a microbridge structure and a pluggable fiber array within the glass substrate. This not only reduces the overall volume of the packaging structure but also effectively improves the structural stability of each component, reducing failures caused by poor packaging or component detachment, and increasing packaging yield. More importantly, this design effectively ensures alignment accuracy, enabling precise docking between the optoelectronic integrated chip and the external optical signal array, achieving efficient and low-loss transmission of optical signals.