Anti-phosphor deposition high thixotropic LED (light-emitting diode) jelly glue

A technology of jelly glue and phosphor powder, applied in luminescent materials, electrical components, circuits, etc., can solve the problems of obvious agglomeration, unfavorable operation, viscosity thickening, etc., to simplify the packaging process, solve color temperature deviation, and high plasticity. Effect

Active Publication Date: 2014-01-08
深圳市晨日科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After adding silica, its thixotropy is obviously improved. With the increase of the addition amount, the thixotropy index becomes larger and the thixotropy becomes better. Conducive to operation

Method used

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  • Anti-phosphor deposition high thixotropic LED (light-emitting diode) jelly glue
  • Anti-phosphor deposition high thixotropic LED (light-emitting diode) jelly glue
  • Anti-phosphor deposition high thixotropic LED (light-emitting diode) jelly glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The preparation process of jelly gum is as follows:

[0046] (1) Preparation of coupling agent KH560 hydrolysis solution: Take 5mL methanol and 45mL distilled water and mix uniformly, add 0.1g (2g / L) glycerol dropwise to the system, adjust the solution pH=4 with acetic acid, and then add 5mL KH560 , Magnetic stirring at room temperature for 2h. The electrical conductivity is measured to be 90μS / cm, which proves that the above hydrolysis method can fully hydrolyze the coupling agent.

[0047] (2) Treatment of fumed silica: Take 100g of Wacker H30 in a round bottom flask, add 100 mL of toluene and 1g of the coupling agent hydrolysate prepared in step (1), stir and reflux at 110°C for 3h. After the reaction was completed, the toluene was removed by rotary evaporation under reduced pressure, and the toluene was dried in an oven at 60° C. overnight.

[0048] (3) Modification of aluminate phosphor YAG-04 (American Intermatix company): Weigh 7.8g YAG-04, add 15mL distilled water, a...

Embodiment 2

[0053] (1) Preparation of coupling agent KH560 hydrolysis solution: Take 15mL methanol and 80mL distilled water and mix uniformly, add 0.3g glycerol dropwise to the system, adjust the solution pH=2 with acetic acid, then add 5mL KH560, and stir magnetically at room temperature 3h. The conductivity is measured to be 88μS / cm, which proves that the above hydrolysis method can fully hydrolyze the coupling agent.

[0054] (2) Treatment of fumed silica: Take 200g of Wacker H20 in a round bottom flask, add 250mL of methanol and 1g of the KH560 hydrolysate prepared in step (1), stir and reflux at 120°C for 2h. After the reaction was completed, the methanol was removed by rotary evaporation under reduced pressure and dried in an oven at 60°C overnight.

[0055] (3) Modification of aluminate phosphor YAG-04 (Intermatix, USA): Weigh 4.5g YAG-04, add 15mL distilled water, and ultrasonically disperse for 9min to obtain YAG-04 solution; then add 0.3g dropwise step (1 ) The prepared KH560 hydro...

Embodiment 3

[0060] (1) Preparation of coupling agent KH570 hydrolysis solution: take 15mL methanol and 80mL distilled water and mix uniformly, add 0.3g glycerol dropwise to the system, adjust the solution pH=2 with acetic acid, then add 5mL KH570, stir magnetically at room temperature 3h. The conductivity is measured to be 85μS / cm, which proves that the above hydrolysis method can fully hydrolyze the coupling agent.

[0061] (2) Treatment of fumed silica: Take 200g of Cabot TS720 in a round bottom flask, add 250mL of xylene and 1g of the KH570 hydrolysate prepared in step (1), stir at 120°C and reflux for 2h. After the reaction was completed, the xylene was removed by rotary evaporation under reduced pressure and dried in an oven at 60°C overnight.

[0062] (3) Modification of silicate phosphor O5742 (Intermatix, USA): Weigh 4.5g of O5742, add 15mL of distilled water, and ultrasonically disperse for 9min to obtain O5742 solution; then add dropwise 0.3g of KH570 hydrolysate prepared in step (1...

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Abstract

The invention discloses anti-phosphor deposition high thixotropic LED (light-emitting diode) jelly glue. By selecting a coupling agent and optimizing hydrolysis conditions, a thixotropic material is obtained by modifying a gas phase, namely silicon dioxide, and anti-deposition phosphor is obtained by modifying phosphor. The thixotropic material is added into a silica gel system to obtain a high thixotropic silica gel system with a thixotropic index which is as high as 5; by adding different types and different contents of modified phosphor into the system, the jelly glue with different color temperatures can be integrally mixed, the jelly glue can not produce deposition within a shelf life of 3 months, and the color temperature value after packaging can be kept unchanged. The jelly glue disclosed by the invention is packaged by a needle cylinder, a mold is not required for assistance, the jelly glue can be directly fixed on a dispensing machine for use, and automatic forming is performed after dispensing. According to the jelly glue disclosed by the invention, the phosphor and the silica gel system are combined into a whole to prepare the jelly glue, the mold packaging step of an LED packaging link can be eliminated, the downstream packaging process is simplified, the production period is shortened, and the production efficiency is improved, so that the jelly glue has good application prospects.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to a highly thixotropic LED jelly glue for preventing fluorescent powder from settling. Background technique [0002] As we all know, in the phosphor powder dispensing process in LED packaging, the phosphor powder and silica gel purchased separately need to be mixed evenly in proportion to prepare fluorescent glue. Phosphor powder is a solid particle with a particle size of about 7-25 μm. The viscosity of conventional two-component addition silica gel is between 2000-6000cps. Due to the large particle size of the phosphor powder and the low viscosity of the silica gel, the phosphor powder is prone to sedimentation in the silica gel system, and it usually needs to be used up within half an hour. If the mixing time is too long, the phosphor powder will settle, which will directly affect the optical consistency of the LED package, that is, the color temperature consistency and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K11/06C09K11/02C09C1/28C09C3/08H01L33/56H01L33/50
Inventor 刘洋钱雪行王本智韩英肖建香蒋剑涛
Owner 深圳市晨日科技股份有限公司
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