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Fingerprint identification chip package structure and packaging method

A chip packaging structure, fingerprint recognition technology, applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, instruments, etc., can solve the adverse effects on the yield and reliability of the final product, time-consuming assembly or packaging process, process Complex steps and other problems, to achieve the effect of reducing manufacturing costs, reducing packaging steps, and reducing packaging volume

Pending Publication Date: 2018-03-02
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the number of discrete components increases, the process steps become more and more complex, and the manufacturing cost increases. At the same time, it has an adverse effect on the yield and reliability of the final product, and the assembly or packaging process of discrete components is time-consuming and inefficient.

Method used

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  • Fingerprint identification chip package structure and packaging method
  • Fingerprint identification chip package structure and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1: see figure 1 , a fingerprint identification chip packaging structure comprising a substrate 8, a fingerprint identification chip 1 is fixed on the substrate 8, the top surface of the fingerprint identification chip 1 is a first surface 12, the bottom surface is a second surface 13, and a fingerprint sensor is set on the first surface 12 Area 2 and several first chip pads 6, a groove 2 is opened on the first surface 12, a redistribution layer RDL is provided on the side wall 4 of the groove, the bottom 5 of the groove and the first surface 12, and the bottom of the groove 3 is fixed with The ASIC chip 7 is electrically connected to the fingerprint recognition chip 1 through the redistribution layer RDL, the ASIC chip 7 is electrically connected to the substrate 8 , and the fingerprint recognition chip 1 is electrically connected to the substrate 8 through the first metal wire 14 . The substrate 8 is provided with a plastic package 10, the plastic package 10...

Embodiment 2

[0040] see figure 2 , a fingerprint identification chip packaging structure comprising a substrate 8, a fingerprint identification chip 1 is fixed on the substrate 8, the top surface of the fingerprint identification chip 1 is a first surface 12, the bottom surface is a second surface 13, and a fingerprint sensor is set on the first surface 12 Area 2 and several first chip pads 6, a groove 2 is opened on the first surface 12, a redistribution layer RDL is provided on the side wall 4 of the groove, the bottom 5 of the groove and the first surface 12, and the bottom of the groove 3 is fixed with The ASIC chip 7 is electrically connected to the fingerprint recognition chip 1 through the redistribution layer RDL, the ASIC chip 7 is electrically connected to the substrate 8 , and the fingerprint recognition chip 1 is electrically connected to the substrate 8 through the first metal wire 14 . The substrate 8 is provided with a plastic package 10, the plastic package 10 is coated wi...

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Abstract

The invention discloses a fingerprint identification chip package structure. A groove is arranged in a non-functional area on a first surface of a fingerprint identification chip, an ASIC chip is arranged in the groove, and the fingerprint identification chip and the ASIC chip are electrically connected through a redistribution layer (RDL); and the fingerprint identification chip and the ASIC chipintegrated into one package body. As a result, the packaging steps are reduced, the production efficiency is increased, the packaging volume is reduced, the manufacturing cost is also greatly reduced, and the product performance is improved at the same time.

Description

technical field [0001] The invention belongs to the field of fingerprint sensor packaging, and in particular relates to a fingerprint identification chip packaging structure and packaging method. Background technique [0002] Fingerprint sensors can be built into electronic devices, such as laptops, tablet computers, smart phones, etc., by reading the user's fingerprint pattern, the device can be unlocked by the authorized user of the device through the authentication of the authorized user's fingerprint pattern, greatly improving Safety of Electronic Devices. [0003] The fingerprint sensor has a sensing area on the surface of the fingerprint sensor chip, which interacts with the external stimuli to be identified to generate electrical signals that the chip can identify and process. In order to realize the sensing function of the fingerprint recognition sensor, an application-specific integrated circuit chip (ASIC chip) for signal processing is also required. The current ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/60H01L23/31H01L23/48G06K9/00
CPCH01L24/43H01L21/56H01L23/31H01L23/3121H01L23/481H01L2224/42G06V40/12H01L2924/181H01L2224/16145H01L2224/48091H01L2224/73265H01L2924/00012H01L2924/00014
Inventor 刘卫东王奎李涛涛刘宇环
Owner HUATIAN TECH XIAN
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