Glass substrate wiring structure, glass substrate and display device

Abstract

The invention provides a glass substrate wiring structure used between a multiplexer (MUX) and an integrated circuit (IC). The glass substrate wiring structure comprises a plurality of connecting lines. The two ends of each connecting line are connected with the MUX and the IC respectively. A preset space is reserved between any two adjacent connecting lines. At least one connecting line is provided with one or more conductive protruding teeth. A certain distance is reserved between each protruding tooth on any connecting line and the adjacent collecting line or between each protruding tooth on any connecting line and each protruding tooth on the adjacent connecting line. The invention further provides a glass substrate and a display device. Wiring resistance can be reduced in existing limited wiring space, and the charging effect of the glass substrate is improved.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to a wiring structure of a glass substrate, a glass substrate and a display device. Background technique [0002] With the development of the flat-panel display industry, modern people continue to put forward higher requirements for the fineness of display quality. Choosing a high-ppi (Pixels per Inch, including the number of pixels per inch) display has become a digital electronic product. Standard configuration. [0003] Such as figure 1 As shown, in the TFT glass substrate manufacturing process of high-ppi displays, the connection between the multiplexer MUX and the integrated circuit IC is basically connected by a plurality of connection lines a with equal spacing and equal line width. However, due to the limitation of MUX and IC Between the wiring space, the wiring resistance has not been improved, resulting in the inability to improve the charging effect of th...

AI Technical Summary

Problems solved by technology

[0003] like figure 1 As shown, in the TFT glass substrate manufacturing process of high-ppi displays, the connection between the multiplexer MUX and the integrated circuit IC is basically connected by a plurality of connection lines a with equal spacing and equal line width. However, due to the limitation of MUX and IC The wiring space between them, the wiring resistance has been unable to be improved, resulting in the inability to improve the charging effect of the glass substrate

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