Al-mg-si-based alloy material, al-mg-si-based alloy plate, and method for manufacturing al-mg-si-based alloy plate

A technology of an alloy material and a manufacturing method, which is applied in the manufacturing field of Al-Mg-Si alloy plates, can solve the problems of poor thermal conductivity and electrical conductivity, low strength and the like

Active Publication Date: 2018-10-23
堺アルミ株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Pure aluminum alloys such as JIS1100, 1050, and 1070 have excellent thermal conductivity, but low strength
Al-Mg alloys (5000 series alloys) such as JIS5052 used as high-strength materials are significantly inferior in thermal conductivity and electrical conductivity compared to pure aluminum alloys

Method used

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  • Al-mg-si-based alloy material, al-mg-si-based alloy plate, and method for manufacturing al-mg-si-based alloy plate
  • Al-mg-si-based alloy material, al-mg-si-based alloy plate, and method for manufacturing al-mg-si-based alloy plate
  • Al-mg-si-based alloy material, al-mg-si-based alloy plate, and method for manufacturing al-mg-si-based alloy plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0154] Examples and comparative examples of the present invention are shown below.

no. 1 Embodiment

[0156] This example is an example for the invention according to claims 1 to 5 .

[0157] Aluminum alloy slabs having different chemical compositions shown in Table 1 were obtained by the DC casting method.

Embodiment 1

[0159] The aluminum alloy slab of chemical composition No. 1 in Table 1 was subjected to face cutting. Next, the alloy slab after face cutting was subjected to homogenization treatment at 560° C. for 5 hours in a heating furnace, and then heated before hot rolling at 540° C. for 4 hours while changing the temperature in the same furnace. After heating before hot rolling, the slab at 540° C. was taken out from the heating furnace, and rough hot rolling was started. After the thickness of the alloy plate in rough hot rolling reaches 25mm, the final pass of rough hot rolling is carried out at an average cooling rate of 80°C / min from the alloy plate temperature 450°C immediately before the pass, and the finish temperature of rough hot rolling is An alloy plate at 221° C. and a thickness of 12 mm. In addition, in the final pass of the rough hot rolling, forced cooling is performed, the alloy sheet is moved while rolling, and the rolled alloy sheet is subjected to water cooling by ...

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Abstract

Provided is an Al-Mg-Si-based alloy material that has high strength while having high conductivity and good processability. The tensile strength of the Al-Mg-Si-based alloy material, which has a fibrous structure, is set to be equal to or greater than 280 MPa, and the conductivity thereof is set to be equal to or greater than 54 % IACS.

Description

technical field [0001] The present invention relates to Al-Mg-Si alloy materials, especially Al-Mg-Si alloy materials with excellent thermal conductivity, electrical conductivity, strength and processability, and the thickness is less than 0.9 mm Al-Mg-Si alloy plate and the manufacturing method of Al-Mg-Si alloy plate. Background technique [0002] For thin TVs, thin monitors for personal computers, notebook computers, tablet computers, car navigation systems, portable navigation systems, smartphones, mobile phones and other portable terminals such as chassis (chassis), metal base printed circuit boards, and inner covers Excellent thermal conductivity, strength, and workability for rapid heat dissipation are required for member materials with built-in or mounted heat generating elements. [0003] Pure aluminum alloys such as JIS1100, 1050, and 1070 have excellent thermal conductivity, but low strength. Al—Mg alloys (5000-series alloys) such as JIS 5052 used as high-streng...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/06C22C21/02C22F1/05C22F1/00
CPCC22C21/02C22C21/06C22F1/00C22F1/05
Inventor 笼重真二谷口和章西森秀树山之井智明
Owner 堺アルミ株式会社
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