Dissipated heat recycling device and method thereof

A recovery device and shroud technology, applied in the computer field, can solve the problems of scattered recovery, unfavorable energy saving, emission reduction and sustainable development, and centralized recovery of heat is not very convenient, so as to achieve less power consumption and improve power supply reuse Efficiency, beneficial to energy saving, emission reduction and environmental governance

Active Publication Date: 2019-02-22
DAWNING INFORMATION IND BEIJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The current mainstream heat dissipation methods are air-cooled heat dissipation and cold plate heat dissipation. The heat recovery of the two heat dissipation methods is relatively scattered, and the centralized recovery of heat brought about by this is not very convenient.
This leads to high energy consumption of IT equipment, which is not conducive to energy saving, emission reduction and sustainable development

Method used

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  • Dissipated heat recycling device and method thereof
  • Dissipated heat recycling device and method thereof
  • Dissipated heat recycling device and method thereof

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Embodiment Construction

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] figure 2 is a schematic diagram of the principle of the heat recovery device according to the embodiment of the present invention. In the following, refer to figure 2 Describe the heat recovery device.

[0025] Refer to attached figure 2 , according to an embodiment of the present invention, the heat dissipation recovery device 200 i...

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Abstract

The embodiment of the invention provides a dissipated heat recycling device and the method. The dissipated heat recycling device comprises an intensified boiling piece, a flow guide cover and an electric generator, wherein the intensified boiling piece is arranged above an electric device and used to effectively intensify the boiling of the cooling liquid in order to generate boiled bubbles, the flow guide cover is arranged above the intensified boiling piece, the internal of the flow guide cover is in the shape of a swirling rifling, the flow guide cover collects boiled bubbles and makes theboiled bubbles to form an eddy, the electric generator is arranged near the outlet of the flow guide cover and converts the kinetic energy of the eddy current flowing out from the outlet into recycledelectric energy. The device greatly improves the reuse efficiency of the power supply of a mainboard (not limited to all the electric equipment of the mainboard), and because the electric energy is less used, it is better for energy conservation, emission reduction and environmental governance.

Description

technical field [0001] Embodiments of the present invention generally relate to the field of computer technology, and more specifically, heat dissipation recovery devices and methods. Background technique [0002] The semiconductor industry follows Moore's Law, and the improvement of technology makes it possible to integrate more transistors per unit chip area. The latest technology has reached 10nm or even 7nm. With the rise of cloud computing, big data, and artificial intelligence technology, the computing power of the chip is required to be stronger, which brings more and more power. [0003] It is a very good technical solution for high-power chips to use phase-change cooling technology. On the premise of successfully solving heat dissipation, a better energy recovery scheme can be provided for the kinetic energy and potential energy of the phase change refrigerant. This field is still relatively new, and no one has carried out related research. [0004] The current m...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): F01D15/10F01D9/02F01D21/00H01L23/427
CPCH01L23/427F01D9/02F01D15/10F01D21/00
Inventor陈进
OwnerDAWNING INFORMATION IND BEIJING