A cooling optimization method for brick power supply

Abstract

The invention discloses a method and device for optimizing heat dissipation of a brick power supply, including setting devices that potentially trigger shadow effects in wave soldering on a printed circuit board away from the brick power supply; expanding the plug-in capacity of the brick power supply on the printed circuit board The hole diameter of the pin hole; reduce the copper laying area around the plug pin hole of the brick power supply on the printed circuit board; set the heat gathering hole and / or the plug pin hole of the brick power supply on the printed circuit board Open hole ring; spray tin to the surface of the printed circuit board. The technical solution of the present invention can perform targeted welding optimization on different pins or different pin holes of the brick power supply and the printed circuit board, improve the tin loading rate of the pins and pin holes, and improve the tin penetration effect of wave soldering, Improve the strength of the solder joints to improve the working stability of the brick power supply.

Description

technical field

[0001] The present invention relates to the field of power supplies, and more specifically, relates to a method for optimizing heat dissipation of a brick power supply. Background technique

[0002] With the development of applications such as high-performance computing and GPU, the power consumption of servers continues to increase, and the 48V power supply scheme for boards is put into use. As the server power design requirements are increasing, the component density is getting higher and higher, and the demand for miniaturization is increasing, so the application of 48V brick power supply is increasing. A brick power supply refers to a modular power supply that looks like a brick and is sealed and filled with glue. In the prior art, the package size of a full brick power supply is 116.8×61×12.7mm, and the package size of a half brick power supply (1 / 2 brick) is 61×57.9× The 12.7mm, 1 / 4 brick power package size is 57.9×36.8×12.7mm. The application of smal...

Examples

Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0027] It should be noted that all the expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same. It can be seen that "first" and "second " is only for the convenience of expression, and should not be understood as a limitation to the embodiments of the present invention, and will not be described one by one in the subsequent embodiments.

[0028] Based on the above purpose, the first aspect of the embodiment of the present invention proposes a method for optimizing the heat dissipation of a brick power supply that can perform targeted soldering optimization on differen...

technical field

[0001] The present invention relates to the field of power supplies, and more specifically, relates to a method for optimizing heat dissipation of a brick power supply. Background technique

[0002] With the development of applications such as high-performance computing and GPU, the power consumption of servers continues to increase, and the 48V power supply scheme for boards is put into use. As the server power design requirements are increasing, the component density is getting higher and higher, and the demand for miniaturization is increasing, so the application of 48V brick power supply is increasing. A brick power supply refers to a modular power supply that looks like a brick and is sealed and filled with glue. In the prior art, the package size of a full brick power supply is 116.8×61×12.7mm, and the package size of a half brick power supply (1 / 2 brick) is 61×57.9× The 12.7mm, 1 / 4 brick power package size is 57.9×36.8×12.7mm. The application of smal...

Examples

Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0027] It should be noted that all the expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same. It can be seen that "first" and "second " is only for the convenience of expression, and should not be understood as a limitation to the embodiments of the present invention, and will not be described one by one in the subsequent embodiments.

[0028] Based on the above purpose, the first aspect of the embodiment of the present invention proposes a method for optimizing the heat dissipation of a brick power supply that can perform targeted soldering optimization on differen...

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