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Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board

A technology of resin composition and barrier layer, which is applied in the fields of photosensitive element, resin composition for barrier layer formation, formation of resist pattern, and manufacture of printed wiring board, can solve the difficulty of photocuring reaction of photopolymerizable compound Problems such as progress, to achieve the effect of excellent resist pattern shape, suppression of defects, and suppression of turbidity

Active Publication Date: 2019-08-23
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the photosensitive layer is exposed after the support film is peeled off, the generated free radicals come into contact with oxygen in the air, and the free radicals are rapidly stabilized (deactivated), making it difficult to carry out the photocuring reaction of the photopolymerizable compound.

Method used

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  • Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board
  • Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board
  • Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0191] Hereinafter, although this indication is demonstrated more concretely based on an Example, this indication is not limited to a following example. In addition, unless otherwise indicated, "part" and "%" are a mass basis.

[0192] First, according to Synthesis Example 1, binder polymers (A-1) shown in Tables 1 to 3 below were synthesized.

Synthetic example 1

[0194] As a polymerizable monomer, 125 g of methacrylic acid, 25 g of methyl methacrylate, 125 g of benzyl methacrylate, and 225 g of styrene were mixed with 1.5 g of azobisisobutyronitrile to prepare a solution a.

[0195] In addition, 1.2 g of azobisisobutyronitrile was dissolved in 100 g of a mixed solution (mass ratio 3:2) of 60 g of methyl cellosolve and 40 g of toluene to prepare solution b.

[0196] On the other hand, to a flask equipped with a stirrer, a reflux cooler, a thermometer, a dropping funnel, and a nitrogen gas introduction tube, a mixture of methyl cellosolve and toluene (hereinafter also referred to as "mixed mixture") was added at a mass ratio of 3:2. Liquid x") 400g, stirred while blowing in nitrogen gas, and heated to 80°C.

[0197] The said solution a was dripped at the mixed liquid x in a flask over 4 hours with the dropping rate fixed, and it stirred at 80 degreeC for 2 hours after that. Next, the solution b was added dropwise to the solution in the ...

Embodiment 1～15 and comparative example 1～7

[0250]

[0251] As the supporting film of the photosensitive element, the PET films shown in Tables 1 to 3 were prepared.

[0252] Details of the PET films shown in Tables 1 to 3 are as follows.

[0253] FB40: biaxially oriented PET film with a three-layer structure having a lubricant layer on the front and back (manufactured by Toray Co., Ltd., product name, thickness: 16 μm)

[0254] A1517: Biaxially oriented PET film with a two-layer structure having a lubricant layer on one side (manufactured by Toyobo Co., Ltd., product name, thickness: 16 μm)

[0255] G2H: Biaxially oriented PET film with a single-layer structure (lubricant-incorporated type) containing a lubricant (manufactured by Teijin DuPont Film Co., Ltd., product name, thickness: 15.5 μm)

[0256] (production of barrier layer)

[0257] Next, the resin composition for barrier layer formation was coated on the PET film (support film) so that the thickness became uniform, and dried with a hot air convection dryer ...

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Abstract

A photosensitive element, a resin composition for forming a barrier layer, a method for forming a resist pattern, and a method for producing a printed wiring board are provided. The composition is used for forming the barrier layer in a photosensitive element which is sequentially provided with a supporting film, a barrier layer and a photosensitive layer in this order, and comprises water-solubleresin, an alcohol having 3 or more carbon atoms and water. The photosensitive element is sequentially provided with the supporting film, the barrier layer and the photosensitive layer in this order,and which has improved releasability of the barrier layer from the supporting film without using a release accelerator.

Description

[0001] The application date of this application is July 20, 2016, the application number is 201680044650.3, and the title of the invention is "photosensitive element, resin composition for barrier layer formation, method for forming a resist pattern, and method for manufacturing a printed wiring board" divisional application of the Chinese patent application. technical field [0002] This indication relates to the manufacturing method of the photosensitive element, the resin composition for barrier layer formation, the formation method of a resist pattern, and a printed wiring board. Background technique [0003] Conventionally, in the field of production of printed wiring boards, photosensitive resin compositions have been widely used as resist materials for etching treatment, plating treatment, etc. The photosensitive element of the layer (hereinafter, also referred to as "photosensitive layer"). [0004] A printed wiring board is manufactured by the following process, fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/11G03F7/004H05K3/06H05K3/18
CPCG03F7/11G03F7/004H05K3/06G03F7/027H05K3/18G03F7/20H05K3/064
Inventor 粂壮和小野博史松村辽
Owner RESONAC CORPORATION
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