A kind of shoes with interlayer can be inlaid with concentrated energy quantum chip

Abstract

The invention relates to a kind of shoes whose interlayer can be embedded with a concentrated energy quantum chip. A clamping device is connected by a sliding fit, the clamping device clamps the chip, and the inner wall of the front end of the interlayer is clamped with a waterproof cover, and the clamping device includes a T-shaped slider that is slidably connected to the T-shaped chute. The invention can solve the problem that the ordinary interlayer existing in existing shoes when the energy-concentrating quantum chip is installed is easy to be squeezed and deformed, the chip is difficult to take out and replace, the interlayer is made of hard material to reduce the comfort of the shoe, and the chip is easily damaged when the shoe is pressed, and the waterproof performance of the ordinary interlayer is poor. Poor and other problems; it can realize the functions of convenient replacement and good protection of the energy-concentrating quantum chip installed in the inner layer of the shoe; it has the advantages of easy chip removal and replacement, no pressure damage, good waterproof performance, and good shoe comfort.

Description

technical field [0001] The invention relates to the field of health care, in particular to a pair of shoes whose interlayers can be inlaid with energy-concentrating quantum chips. Background technique [0002] With the improvement of people's living standards, people pay more and more attention to health, and the advancement of science and technology is constantly updating people's thinking about health care. The energy-gathering quantum chip can receive electromagnetic waves in space and generate bioelectric waves to coordinate the natural state of the human body. The generated bioelectric frequency can promote metabolism, activate cells, and enhance the self-healing ability of the human body. It only needs to install the energy-concentrating quantum chip in shoes and clothing. However, there are many problems when installing chips in shoes. : [0003] Problem 1: The chip installed in the existing shoes is only by setting an interlayer in the shoe. If the shoe is used for ...

AI Technical Summary

Problems solved by technology

[0003] Problem 1: The chip installed in the existing shoes is only by setting an interlayer in the shoe. If the shoe is used for a long time, the interlayer will be squeezed and deformed, making it difficult to remove or replace the chip;

[0004] Question 2: To install the chip in the shoes, in order to ensure that the chip is not damaged, the bottom of the shoe is generally made of a harder material, which reduces the comfort of the shoe;

[0005] Problem 3: The chip installed in the existing shoe interlayer will be under pressure when walking, and the chip will be easily damaged when the pressure is high. At the same time, the waterproof performance of the ordinary interlayer is poor, and the chip is easily damaged by water.

[0006] For the problems listed above, there is no better exploration and practice results under the existing technical conditions. Therefore, it is necessary to do further exploration and practice to solve the problems listed above

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