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A kind of LED panel and display device

A technology for display devices and LED chips, which can be applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as low production efficiency

Active Publication Date: 2021-06-04
HISENSE VISUAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention provides an LED board and a display device to solve the problem of low production efficiency in the production process of Mini LED boards existing in the prior art

Method used

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  • A kind of LED panel and display device
  • A kind of LED panel and display device
  • A kind of LED panel and display device

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Embodiment Construction

[0061] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0062] The Mini LED backlight panel adopts partition settings, the Mini LEDs in the zone are connected in series, and the zones are connected in parallel. If one Mini LED is not welded properly, all the Mini LEDs in the zone will not light up.

[0063] Such as figure 1 Shown is a schematic structural diagram of the Mini LED backlight display circuit schematic. figure 1 , only a part of the schematic diagram of the MiniLED backlight circui...

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Abstract

The invention discloses an LED board and a display device, which are used to solve the problem of low production efficiency in the production process of the Mini LED board existing in the prior art. The LED board of the present invention includes a substrate and an LED chip formed on the substrate. The substrate is provided with a pad assembly corresponding to the LED chip. In a pair of LED chips and pad assemblies corresponding to each other, the positive electrode contained in the pad assembly is Pad gaps of at least two sizes are formed between the pad group and the cathode pad group, and the LED chip is welded on the pad assembly through one of the pad gaps of one size. Since there are at least two sizes of pad gaps, one size of pad gaps can be selected from at least two sizes of pad gaps, and the LED chip is soldered to the pads through the selected size of pad gaps On components, poor welding is reduced and production efficiency is improved; when repairing, it is directly repaired through the gaps of other pads, reducing the difficulty of repairing.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an LED panel and a display device. Background technique [0002] Mini LED (Mini Light Emitting Diode, miniature light-emitting diode) has become a current hot spot in LCD (Liquid Crystal Display, liquid crystal display) display as a backlight. A huge number of Mini LED grains are used as the backlight source. This solution has the advantages of adjustable regional brightness, high color rendering and contrast, and can achieve 8K display effect. Multi-zone dynamic backlighting due to high peak brightness LEDs contributes to improved display contrast and high dynamic range. Therefore, Mini LED as a technical solution for backlighting has been applied in many fields such as TV, mobile phone, and vehicle display. [0003] Mini LED chips need to be soldered to a substrate to form a Mini LED board. During the soldering process, if the pad spacing of the Mini LED chip is equal to th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L25/075
CPCH01L25/0753H01L33/62H01L2933/0066
Inventor 李富琳唐兆兵乔明胜
Owner HISENSE VISUAL TECH CO LTD
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