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A kind of fp chip shaping device and shaping method

A shaping device and chip technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of thin and fragile pins, affecting welding quality, and affecting the coplanar shape of chip pins, so as to ensure the forming quality, Effect of reducing welding defects and improving solderability

Active Publication Date: 2019-04-16
LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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AI Technical Summary

Problems solved by technology

This type of chip needs to be reshaped before welding. The reshaping effect directly affects the coplanar shape of the chip pins and affects the welding quality.
However, due to the large number of pins of the FP chip, the pins are thin and fragile, and the body is difficult to clamp, there is no effective manual forming tool at this stage.

Method used

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  • A kind of fp chip shaping device and shaping method
  • A kind of fp chip shaping device and shaping method

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Embodiment Construction

[0019] Embodiments of the present invention are described in detail below, and the embodiments are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0020] At present, the plastic processing of FP chips before packaging is mostly manual single processing. Due to the large number of pins of the FP chip itself, the pins are thin and fragile, and the body is difficult to clamp, the current manual single processing is time-consuming, laborious, and inefficient. The pass rate is high. In order to solve the above problems, the present invention proposes a convenient, safe and reliable FP chip shaping device. At the same time, the invention also provides an FP chip shaping method.

[0021] Such as figure 1 As shown, the FP chip shaping device includes a lower shaping block 1 and an upper shaping block 6; the lower shaping block 1 and the upper shaping block 6 are hinged through a hinge structure 3; the lower sh...

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Abstract

The invention discloses an FP chip shaping device and shaping method, and belongs to the technical field of electronic assembly. The FP chip shaping device comprises a lower shaping block and an upper shaping block, and is characterized in that the lower shaping block and the upper shaping block are hinged through a hinge structure; the lower shaping block is provided with a shaping concave groove; the upper shaping block is fixedly provided with a shaping convex groove matched with the shaping concave groove; the upper shaping block is provided with cutter cutting openings at two sides of the shaping convex groove; and the upper shaping block is further provided with a handle. The FP chip shaping device and shaping method provided by the invention solve problems of difficult manual shaping, poor coplanarity, easy breakage of pins and the like of FP packaging, can effectively ensure the FP chip shaping quality and the coplanarity of a shaped chip, improve weldability of the chip and reduce occurrence of poor welding.

Description

technical field [0001] The invention belongs to the technical field of electronic assembly, and in particular relates to an FP chip shaping device and shaping method. Background technique [0002] FP packaging is a common packaging form of surface mount devices, such as IDT54FCT162245ATEB, SNJ54LVTH16244AWD, 74LVC125AD, 74LVC126AD and other data or bus drivers. This type of chip needs to be reshaped before welding, and the reshaping effect directly affects the coplanar shape of the chip pins and affects the welding quality. However, due to the large number of pins of the FP chip, the pins are thin and fragile, and the body is difficult to clamp, there is no effective manual forming tool at this stage. Contents of the invention [0003] In order to overcome the defects of the prior art, one of the objects of the present invention is to provide a convenient, safe and reliable FP chip shaping device. At the same time, the invention also provides a FP chip shaping method. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B21F11/00
CPCB21F11/00H01L21/67092
Inventor 喻波韦双李号召盛军吴晓鸣
Owner LUOYANG INST OF ELECTRO OPTICAL EQUIP OF AVIC
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