Preparation method of Mini LED display module
A display module and chip technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low efficiency, poor welding wire, disconnection, etc., and achieve good reliability, high mechanical strength, simple and convenient The effect of volume transfer
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0018] In order to more clearly illustrate the implementation cases of the present invention or the technical solutions in the prior art, the specific embodiments of the present invention will be described below with reference to the drawings. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings and obtained Other embodiments.
[0019] The invention provides a method for preparing a Mini LED display module, including:
[0020] S1 prepares the vertical structure of the red light chip 1, the green light chip 2 and the blue light chip 3, the red light chip, the green light chip and the blue light chip have a bump structure on the P electrode side, such as figure 1 As shown, the red chip 1 corresponds to the boss structure 11, the green chip 2 corresponds to the boss structure 21, and the blue chip 3 corresponds to th...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com