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45results about How to "Mass transfer" patented technology

Mass transfer method of micro LED chips

The invention discloses a mass transfer method of micro LED chips, which comprises the steps of preparing micro LED chips on a growth substrate; equipping a temporary carrier with a sticky surface onone side; placing the chips on the surface of the growth substrate towards the temporary carrier, stripping the chips from the growth substrate and dropping the chips to the surface of the temporary carrier; preparing a stamp with a specific material, wherein the surface of the stamp is provided with regularly arranged bumps, and the surfaces of the bumps are sticky; placing the side with bumps ofthe stamp towards the surface of the temporary carrier, carrying out UV irradiating or heating on the temporary carrier, and enabling the bumps in the stamp to take down the corresponding chips fromthe surface of the temporary carrier; placing the stamp with the chips towards a target substrate, transferring the chips to the surface of the target substrate by means of bonding, and carrying out UV irradiating or heating on the bumps on the stamp so as to remove the stamp; and repeating the steps S2-S6 until the mass transfer of the chips is completed. The mass transfer method is simple and convenient, can achieve the purpose without complex equipment and saves a lot of cost.
Owner:北京易美新创科技有限公司

Microelement capable of being tested and micro-transferred, manufacturing, testing and transferring method of microelement and display device

The invention provides a microelement capable of being tested and micro-transferred, a manufacturing, testing and transferring method of the microelement and a display device. A first electrode and asecond electrode of a LED chip extend to the surface of a bonding layer corresponding to a groove through the side wall of the LED chip respectively, so that the first electrode and the second electrode are exposed above the groove and play a role in supporting the LED chip in an inverted suspended state. And meanwhile, the first test electrode and the second test electrode can be used for carrying out an electrical test before the LED core particles are transferred, so that the yield screening of the LED core particles is realized, the LED core particles with abnormal electrical properties are prevented from being transferred to the substrate, and the repair cost is further reduced. And then, in a subsequent transfer process, metal of the first electrode and the second electrode exposed above the groove can be used as a chain for mass transfer, an exposed bonding layer is used as an anchor, and the micro-element is positioned to each anchor through transfer equipment, so that mass transfer of the micro-element can be realized.
Owner:XIAMEN QIANZHAO SEMICON TECH CO LTD

A micro device laser peeling huge quantity transfer device and method based on winding process

The invention belongs to the technical field of semiconductors, and particularly discloses a micro device laser peeling huge quantity transfer device and method based on winding process, The inventioncomprises a micro device stripping and transferring module, an auxiliary tape carrying module, a transition tape carrying module, a transfer tape carrying module, a substrate carrying module, a microdevice filling module, a curing module, a packaging module and a substrate transferring module, wherein the micro device stripping and transferring module is used for realizing the detection and stripping of the micro device; The auxiliary tape module is used to adhere the stripping micro-device; The transition tape module is used for picking up the micro device and transferring it to the transfer tape module. The transfer tape module is used for picking up the micro device and transferring it to the substrate carrying module. A substrate carry module is used for pas that micro device into afilling module, a curing module, a packaging module and a substrate handling module to realize filling, curing, packaging and loading and unloading. The invention realizes the massive transfer of themicro device by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.
Owner:HUAZHONG UNIV OF SCI & TECH

Preparation method of Mini LED display module

The invention provides a Mini LED display module preparation method. The method comprises the steps that a red light wafer, a green light wafer and a blue light wafer which are of a vertical structureare prepared, and one side of a P electrode of each of the red light wafer, the green light wafer and the blue light wafer is of a boss structure; a polyester film is prepared on the surface of a supporting film, and grooves matching the boss structures on one sides of the P electrodes of the red light wafer, the green light wafer and the blue light wafer respectively are prepared in the polyester film; the red light wafer, the green light wafer and the blue light wafer are embedded into the groove of the polyester film in sequence; the red light wafer, the green light wafer and the blue light wafer are transferred to the surface of the transparent conductive substrate through one side of an N electrode, and the support film and the polyester film are removed; epoxy resin glue is filled among the red light wafer, the green light wafer and the blue light wafer; and the red light wafer, the green light wafer and the blue light wafer are welded with the substrate with the circuit throughone side of the P electrode to finish the preparation of the Mini LED display module. A large amount of wafers can be transferred easily and conveniently, and the prepared Mini LED display module ishigh in mechanical strength and good in reliability.
Owner:LATTICE POWER (JIANGXI) CORP

A microdevice mass transfer device and method based on differential speed matching of transfer axes

The invention belongs to the technical field of semiconductors, and particularly discloses a micro device mass transfer device and method based on differential speed matching of transfer axes, which comprises a microdevice stripping transfer module, a primary transfer shaft module, a secondary transfer shaft module, a substrate bearing module, a microdevice filling module, a curing module, a packaging module and a substrate handling module, wherein the microdevice stripping transfer module is used for stripping and transferring the microdevice to the primary transfer shaft module; The primarytransfer shaft module is used for picking up the microdevices and adjusting the spacing of the microdevices. The secondary transfer shaft module is used for picking up the microdevices on the primarytransfer shaft module and adjusting the spacing of the microdevices; The substrate carrying module is used for picking up the micro devices on the secondary transfer shaft module and sending them intothe micro device filling module, the curing module, the encapsulation module and the substrate handling module to realize filling, curing, encapsulation and loading and unloading. The invention realizes the massive transfer of the micro device by using the differential speed matching of the transfer shaft, which has the advantages of high production efficiency and low production cost.
Owner:HUAZHONG UNIV OF SCI & TECH

Alignment device and alignment method for mass transfer of micro LED through laser assistance

The invention belongs to the related technical field of micro LED mass transfer, and discloses an alignment device and an alignment method for mass transfer of a micro LED through laser assistance, and the device comprises a mask projection assembly which comprises a self-defined mask plate and a mask plate fine adjustment device; the self-defined mask plate is provided with a hollow pattern; the mask plate fine adjustment device comprises a manual rotary table, a Z-direction displacement table and an X-direction displacement table which are connected in sequence; the self-defined mask plate is connected to the end part of the manual turntable; a camera alignment system comprises at least two cameras, a cross wire is arranged in the view center of each camera, and each camera is arranged on the corresponding Y-direction displacement table; and a motion platform system comprises a chip motion module and a drive circuit motion module, and alignment and positioning of a light spot, a chip and a drive circuit are achieved through a cross wire of a camera. According to the invention, accurate calibration and alignment of the laser spot, the chip and the driving circuit can be realized, the structure is simple, and the application value is great.
Owner:HUAZHONG UNIV OF SCI & TECH

Micro LED mass transfer self-leveling device and application thereof

The invention belongs to the related technical field of semiconductors, and discloses a Micro LED mass transfer self-leveling device and application thereof. The device comprises: a lower wafer motion table which comprises a first support with the freedom degrees in the X direction, the Y direction and the Z direction and a sliding table; an upper wafer moving platform which comprises a second bracket with degrees of freedom in X, Y and Z directions and an adsorption structure; and a substrate direct-driven self-leveling micro holder which comprises a spherical motor and a self-leveling micro holder, wherein the spherical motor is arranged on the sliding table, and the self-leveling micro holder is driven by the spherical motor to rotate or lock in the X, Y or Z direction. The self-leveling micro holder comprises a synchronous adjusting disc and a lower wafer adsorption disc, a plurality of top columns are arranged on the surface of the synchronous adjusting disc, a force sensor is arranged above each top column, and the lower wafer adsorption disc is provided with holes corresponding to the top columns so that the force sensors can protrude out of the surface of the lower wafer adsorption disc. The device is not limited by the area of the transfer head, the parallelism in the large-plane transfer process can be achieved, and the transfer efficiency is remarkably improved.
Owner:HUAZHONG UNIV OF SCI & TECH

A device and method for laser lift-off mass transfer of micro-device based on winding process

The invention belongs to the technical field of semiconductors, and specifically discloses a micro-device laser peeling mass transfer device and method based on a winding process, which includes a micro-device peeling transfer module, an auxiliary carrier tape module, a transition carrier tape module, a transfer carrier Belt module, substrate carrying module, micro-device filling module, curing module, packaging module and substrate handling module, micro-device peeling transfer module is used to realize the detection and peeling of micro-device; auxiliary tape-carrying module is used for adhesion and stripping of micro-device; transition The carrier tape module is used to pick up micro devices and transfer them to the transfer carrier tape module; the transfer carrier tape module is used to pick up micro devices and transfer them to the substrate carrier module; the substrate carrier module is used to send micro devices into Filling, curing, packaging and loading and unloading are realized in the filling module, curing module, packaging module and substrate handling module. Through the invention, the mass transfer of micro devices is realized by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.
Owner:HUAZHONG UNIV OF SCI & TECH

Micro-LED chip mass transfer method

The invention discloses a mass transfer method of micro LED chips, which comprises the steps of preparing micro LED chips on a growth substrate; equipping a temporary carrier with a sticky surface onone side; placing the chips on the surface of the growth substrate towards the temporary carrier, stripping the chips from the growth substrate and dropping the chips to the surface of the temporary carrier; preparing a stamp with a specific material, wherein the surface of the stamp is provided with regularly arranged bumps, and the surfaces of the bumps are sticky; placing the side with bumps ofthe stamp towards the surface of the temporary carrier, carrying out UV irradiating or heating on the temporary carrier, and enabling the bumps in the stamp to take down the corresponding chips fromthe surface of the temporary carrier; placing the stamp with the chips towards a target substrate, transferring the chips to the surface of the target substrate by means of bonding, and carrying out UV irradiating or heating on the bumps on the stamp so as to remove the stamp; and repeating the steps S2-S6 until the mass transfer of the chips is completed. The mass transfer method is simple and convenient, can achieve the purpose without complex equipment and saves a lot of cost.
Owner:北京易美新创科技有限公司
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