45results about How to "Mass transfer" patented technology

A method for manufacturing a display element comprising a plurality of pixels, each comprising a plurality of sub-pixels. The method comprises undertaking, using a pick up tool, a first placement cycle (1908) comprising picking up a plurality of first, untested LED dies and placing them on a display substrate at locations corresponding to the plurality of pixels, testing (1912) the first LED emitters on the display substrate to determine one or more locations of non-functional first LED emitters, selecting one or more second tested LED dies based on a result of the test, configuring the selected one or more second LED dies to enable their pick up and placement on the display substrate and undertaking, using the PUT, a second placement cycle (2008) comprising picking up the selected one or more second LED dies and placing them on the display substrate at the determined locations of the non-functional first LED emitters.

The invention discloses a preparation method of a light emitting display. The preparation method comprises the steps of providing a packaging substrate, sinking the packaging substrate into a suspension, sinking a plurality of light emitting diodes into the suspension, and horizontally injecting the suspension, wherein a plurality of recesses are arranged at the top of the packaging substrate; each recess is provided with a first electrode region and a second electrode region in different height; the light emitting diodes are provided with planes and curved surfaces; the suspension has different flow rates on the planes and the curved surfaces of the light emitting diodes; all the light emitting diodes are respectively embedded into all the recesses according to the different flow rates; and each light emitting diode is electrically connected with the first electrode region and the second electrode region of the corresponding recess to form the light emitting display. According to thepreparation method, the packaging substrate and the light emitting diodes are assembled according to a bernoullis theorem on the premise that no damage is caused to the packaging substrate or the light emitting diodes.

A bioreactor system for manufacturing and extracting a desired biomaterial from a microorganism by fermenting the microorganism in the bioreactor. The system includes a horizontal reactor vessel, one or more vertical discs rotatably mounted around a hollow shaft, a motor to power the shaft, and one or more spray nozzles arranged to spray required liquids on to the discs. The system is arranged so that the microorganism is not kept submerged within the reactor vessel during the fermentation process. The system is suitable for any type of microorganism, including fungi and bacteria, and can be modified to produce many types of desired biomaterials, including antibiotics, enzymes, ethanol, butanol, chitin, and chitosan. The method of the present invention generally provides steps for placing substrate on the vertical discs of the reactor vessel, inoculating the discs, introducing media, fermenting the microorganism, and extracting the desired biomaterial from the reactor vessel.

The invention belongs to the technical field of semiconductors, and specifically discloses a micro-device laser peeling mass transfer device and method based on a winding process, which includes a micro-device peeling transfer module, an auxiliary carrier tape module, a transition carrier tape module, a transfer carrier Belt module, substrate carrying module, micro-device filling module, curing module, packaging module and substrate handling module, micro-device peeling transfer module is used to realize the detection and peeling of micro-device; auxiliary tape-carrying module is used for adhesion and stripping of micro-device; transition The carrier tape module is used to pick up micro devices and transfer them to the transfer carrier tape module; the transfer carrier tape module is used to pick up micro devices and transfer them to the substrate carrier module; the substrate carrier module is used to send micro devices into Filling, curing, packaging and loading and unloading are realized in the filling module, curing module, packaging module and substrate handling module. Through the invention, the mass transfer of micro devices is realized by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.

The invention discloses a mass transfer method of micro LED chips, which comprises the steps of preparing micro LED chips on a growth substrate; equipping a temporary carrier with a sticky surface onone side; placing the chips on the surface of the growth substrate towards the temporary carrier, stripping the chips from the growth substrate and dropping the chips to the surface of the temporary carrier; preparing a stamp with a specific material, wherein the surface of the stamp is provided with regularly arranged bumps, and the surfaces of the bumps are sticky; placing the side with bumps ofthe stamp towards the surface of the temporary carrier, carrying out UV irradiating or heating on the temporary carrier, and enabling the bumps in the stamp to take down the corresponding chips fromthe surface of the temporary carrier; placing the stamp with the chips towards a target substrate, transferring the chips to the surface of the target substrate by means of bonding, and carrying out UV irradiating or heating on the bumps on the stamp so as to remove the stamp; and repeating the steps S2-S6 until the mass transfer of the chips is completed. The mass transfer method is simple and convenient, can achieve the purpose without complex equipment and saves a lot of cost.