A micro device laser peeling huge quantity transfer device and method based on winding process

Abstract

The invention belongs to the technical field of semiconductors, and particularly discloses a micro device laser peeling huge quantity transfer device and method based on winding process, The inventioncomprises a micro device stripping and transferring module, an auxiliary tape carrying module, a transition tape carrying module, a transfer tape carrying module, a substrate carrying module, a microdevice filling module, a curing module, a packaging module and a substrate transferring module, wherein the micro device stripping and transferring module is used for realizing the detection and stripping of the micro device; The auxiliary tape module is used to adhere the stripping micro-device; The transition tape module is used for picking up the micro device and transferring it to the transfer tape module. The transfer tape module is used for picking up the micro device and transferring it to the substrate carrying module. A substrate carry module is used for pas that micro device into afilling module, a curing module, a packaging module and a substrate handling module to realize filling, curing, packaging and loading and unloading. The invention realizes the massive transfer of themicro device by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and more specifically relates to a micro-device laser lift-off mass transfer device and method based on a winding process. Background technique [0002] Micro-LED technology, that is, LED miniaturization and matrix technology, refers to the integration of high-density micro-sized LED arrays on a chip. For example, each pixel of an LED display can be addressed and individually driven to light up, which can be regarded as an LED A miniature version of the display, reducing the pixel distance from millimeters to microns. The advantages of Micro-LED are obvious. It inherits the characteristics of high efficiency, high brightness, high reliability and fast response time of inorganic LED, and has the characteristics of self-illumination without backlight, more energy-saving, simple mechanism and small size. , thin and other advantages. In addition, because the size of the micro-device is extre...

AI Technical Summary

Problems solved by technology

The existing chip transfer technology generally uses a robot to pick up the chip and then transfer it to the target substrate. However, a Micro-LED display needs millions of Micro-LED chips. The traditional method is too inefficient to meet the requirements of Micro-LED. Requirements for mass transfer of micro-devices in the preparation of LED displays

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