This invention discloses an adjustable energy field material
processing device and its multi-field coupled material
processing system and method. The device includes at least one energy field unit, an energy field application area, a feeding unit, a workpiece support, and a
control system. The energy field unit can generate acoustic, electric, magnetic, optical,
airflow, thermal, and
plasma fields, or any combination thereof, and can be adjusted by position, angle, distance, or attitude to form a relatively adjustable energy field distribution with the workpiece. After the material enters the energy field application area via spraying, dripping, misting, sprinkling,
liquid injection,
powder conveying, or manual feeding, it can be picked up, suspended, directionally transported, aggregated, and deposited at specific points under the influence of the energy field. The
application areas of multiple energy field units can overlap or be adjacent, forming superimposed, interfering, focused, or enclosed multi-field coupled
application areas to improve transport stability and deposition accuracy. The device may further include an
electric field component or a perturbed energy field unit to enhance deposition uniformity or redistribute, homogenize, thin, or locally peel off the deposited layer. The
system is suitable for open environments or enclosed cavities (
atmospheric pressure, low pressure, vacuum,
inert atmosphere, special
atmosphere, etc.), and can achieve non-contact, high-precision
coating, deposition, and surface control of various materials such as droplets, mists, powders, colloids, and nanoparticles. This invention has significant advantages such as
open structure, wide applicability to materials, high
controllability of deposition, multi-field
scalability, and the ability to achieve high-quality deposition on complex surfaces.