A device and method for laser lift-off mass transfer of micro-device based on winding process

Abstract

The invention belongs to the technical field of semiconductors, and specifically discloses a micro-device laser peeling mass transfer device and method based on a winding process, which includes a micro-device peeling transfer module, an auxiliary carrier tape module, a transition carrier tape module, a transfer carrier Belt module, substrate carrying module, micro-device filling module, curing module, packaging module and substrate handling module, micro-device peeling transfer module is used to realize the detection and peeling of micro-device; auxiliary tape-carrying module is used for adhesion and stripping of micro-device; transition The carrier tape module is used to pick up micro devices and transfer them to the transfer carrier tape module; the transfer carrier tape module is used to pick up micro devices and transfer them to the substrate carrier module; the substrate carrier module is used to send micro devices into Filling, curing, packaging and loading and unloading are realized in the filling module, curing module, packaging module and substrate handling module. Through the invention, the mass transfer of micro devices is realized by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and more specifically relates to a micro-device laser lift-off mass transfer device and method based on a winding process. Background technique [0002] Micro-LED technology, that is, LED miniaturization and matrix technology, refers to the integration of high-density micro-sized LED arrays on a chip. For example, each pixel of an LED display can be addressed and individually driven to light up, which can be regarded as an LED A miniature version of the display, reducing the pixel distance from millimeters to microns. The advantages of Micro-LED are obvious. It inherits the characteristics of high efficiency, high brightness, high reliability and fast response time of inorganic LED, and has the characteristics of self-illumination without backlight, more energy-saving, simple mechanism and small size. , thin and other advantages. In addition, because the size of the micro-device is extre...

AI Technical Summary

Problems solved by technology

The existing chip transfer technology generally uses a robot to pick up the chip and then transfer it to the target substrate. However, a Micro-LED display needs millions of Micro-LED chips. The traditional method is too inefficient to meet the requirements of Micro-LED. Requirements for mass transfer of micro-devices in the preparation of LED displays

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