Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system for transferring large number of MicroLED chips

A chip and a huge amount of technology, which is applied in the field of mass transfer of MicroLED chips, can solve the problems of MicroLED chips that cannot guarantee accurate positioning and are difficult to control, and achieve the effects of batch processing, easy control, and strong feasibility

Inactive Publication Date: 2020-04-10
FOSHAN NATIONSTAR SEMICON
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, during the transfer process, the adsorption liquid is used for transfer. Under the influence of negative pressure, the adsorption liquid is difficult to control, resulting in the inability to ensure accurate positioning of the MicroLED chip.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for transferring large number of MicroLED chips
  • Method and system for transferring large number of MicroLED chips
  • Method and system for transferring large number of MicroLED chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0056] Such as figure 1 As shown, the present invention provides a method for mass transfer of MicroLED chips, including:

[0057] S101. Provide a substrate, the surface of the substrate is provided with a first metal layer;

[0058] The substrate may be made of glass, metal or plastic, but is not limited thereto. The surface of the substrate is provided with a first metal layer. Since the MicroLED chip needs to be transferred to the PCB board eventually, the position of the first metal layer on the substrate needs to correspond to the chip soldering point on the PCB board.

[0059] preferred, such as figure 2 As shown, the substrate 1 is a concave substrate, the concave substrate is provided with a plurality of grooves 11 , and the first metal layer 12 is dis...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for transferring a large number of MicroLED chips. The method comprises the following steps: providing a substrate, arranging a first metal layer on the surface of thesubstrate,wherein passivated metal is selected as the first metal layer, and the resistivity of the passivated metal is less than or equal to 110 n[Omega].m; arranging a second metal layer on the bottom surface of a MicroLED chip, wherein the second metal layer is made of second metal, and the second metal can adsorb anions after being irradiated by the UV light source; cleaning surface ions ofthe first metal layer through a plasma cleaning machine to enable the first metal layer to carry positive ions; irradiating the second metal layer of the MicroLED chip with ultraviolet light to enablethe second metal layer to carry negative ions; and putting the substrate and the MicroLED chip in non-conductive liquid, and the transferring the MicroLED chip to the substrate through electric ion adsorption. By the adoption of the method for transferring the large number of MicroLED chips, large-scale transfer is achieved, operation is easy, efficiency is high, and positioning is accurate.

Description

technical field [0001] The present invention relates to the technical field of MicroLED chips, in particular to a method and system for mass transfer of MicroLED chips. Background technique [0002] MicroLEDs are brighter and more efficient than existing OLED technology, but consume less power. The excellent characteristics of Micro LED will make it suitable for TV, iPhone and iPad. [0003] The display principle of MicroLED Display is to make the LED structure design into thin film, miniaturization, and array. The transparent and opaque substrates; and then use the physical deposition process to complete the protective layer and the upper electrode, and then the upper substrate can be packaged to complete the Micro LED display with a simple structure. [0004] Batch transfer refers to uniformly soldering three to five hundred, or even more red, green and blue primary color LED tiny grains on a TFT circuit substrate the size of a fingernail, in accordance with the necessar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/15H01L33/00H01L21/67
CPCH01L33/005H01L27/156H01L21/67138
Inventor 仇美懿林耀辉庄家铭
Owner FOSHAN NATIONSTAR SEMICON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com