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A wall thermal insulation material with low thermal conductivity

A thermal conductivity, thermal insulation technology, applied in thermal insulation, building components, climate change adaptation, etc., can solve problems affecting the durability of wall thermal insulation materials, difficult assembly of thermal insulation material boards, unfavorable user filling and other problems , to achieve the effect of lowering the temperature, lowering the production cost and reducing the absorption

Active Publication Date: 2021-08-17
南通鑫范新型建材有限公司
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  • Abstract
  • Description
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Problems solved by technology

[0004] The purpose of the present invention is to provide a wall thermal insulation material with low thermal conductivity to solve the problem that the wall thermal insulation material on the market proposed in the background technology has no corresponding filler inside, and the overall cost is too high, which affects the The thermal conductivity is not conducive to the user's filling, and the assembly of multiple thermal insulation material panels is not easy, which affects the durability of the wall thermal insulation material.

Method used

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  • A wall thermal insulation material with low thermal conductivity
  • A wall thermal insulation material with low thermal conductivity
  • A wall thermal insulation material with low thermal conductivity

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer" , "front end", "rear end", "head", "tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather...

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Abstract

The invention relates to a wall thermal insulation material with low thermal conductivity, which comprises a wall panel frame, a placement frame and a support plate. The inner sides of the wall panel frame are provided with heat insulation frames, and the top of the heat insulation frame is connected with a The space reflective thermal insulation paint board, the bottom end of the space reflective thermal insulation paint board is filled with rock wool, and the bottom end of the filled rock wool is provided with an expanded perlite board, and the bottom end of the expanded perlite board is connected with a combination of board, and the bottom end of the merged board is provided with a lower panel, the bottom end of the lower panel is provided with a mounting frame, and the bottom end of the mounting frame is provided with a supporting plate. The beneficial effect of the present invention is that the supporting plate can be passed through the The thermal insulation combination block of T" structure is placed between the convex frames, which effectively clamps the support plate between the convex frames, which is convenient for the user to manually place and fill, and assemble multiple thermal insulation material panels Filling to improve the durability of wall insulation and heat insulation materials.

Description

technical field [0001] The invention relates to the technical field of wall thermal insulation materials, in particular to a wall thermal insulation material with low thermal conductivity. Background technique [0002] Thermal insulation materials are generally light, loose, porous, and fibrous materials. According to their composition, they can be divided into organic materials and inorganic materials. The former has better thermal insulation performance than the latter, but the latter is more durable than the former. Good thermal conductivity, the thermal conductivity is the main index to measure the performance of thermal insulation materials, the smaller the thermal conductivity, the smaller the heat transmitted through the material, the better the thermal insulation performance, the high cost of internal fillers, easy to reduce the wall The effect of body heat insulation materials. [0003] Wall thermal insulation materials on the market do not have corresponding fille...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04B1/76E04B1/78
CPCE04B1/76E04B1/78Y02A30/244
Inventor 吴军钱志荣钱竞祥周圣伟胡爱华胡凌华
Owner 南通鑫范新型建材有限公司
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