Wall thermal insulation material with low thermal conductivity coefficient

Abstract

The invention relates to a wall thermal insulation material with a low thermal conductivity coefficient. The wall thermal insulation material comprises a wall panel frame, placing frames and supporting boards. Heat insulation frames are arranged on the inner two sides of the wall panel frame, and the top ends of the heat insulation frames are connected with space reflective heat-insulating coatingboards, wherein rock wool filled materials are arranged at the bottom ends of the space reflective heat-insulating coating boards, and expanded perlite boards are arranged at the bottom ends of the rock wool filled materials; and the bottom ends of the expanded perlite boards are connected with combined boards, lower panels are arranged at the bottom ends of the combined boards, the placing frames are arranged at the bottom ends of the lower panels, and the supporting boards are arranged at the bottom ends of the placing frames. The wall thermal insulation material has the beneficial effectsthat the supporting boards can be arranged between convex frames through thermal insulation combination block of a T-shaped structure, the supporting boards are effectively clamped between the convexframes, a user can conveniently and manually arrange and fill, and a plurality of thermal insulation material boards are assembled for filling, so that the durability of the wall thermal insulation material is improved.

Description

technical field [0001] The invention relates to the technical field of wall thermal insulation materials, in particular to a wall thermal insulation material with low thermal conductivity. Background technique [0002] Thermal insulation materials are generally light, loose, porous, and fibrous materials. According to their composition, they can be divided into organic materials and inorganic materials. The former has better thermal insulation performance than the latter, but the latter is more durable than the former. Good thermal conductivity, the thermal conductivity is the main index to measure the performance of thermal insulation materials, the smaller the thermal conductivity, the smaller the heat transmitted through the material, the better the thermal insulation performance, the high cost of internal fillers, easy to reduce the wall The effect of body heat insulation materials. [0003] Wall thermal insulation materials on the market do not have corresponding fille...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a wall thermal insulation material with low thermal conductivity to solve the problem that the wall thermal insulation material on the market proposed in the background technology has no corresponding filler inside, and the overall cost is too high, which affects the The thermal conductivity is not conducive to the user's filling, and the assembly of multiple thermal insulation material panels is not easy, which affects the durability of the wall thermal insulation material.

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