Partitioned cooling type computer mainframe box

Abstract

The invention relates to the technical field of computer equipment, particularly relating to a partitioned cooling type computer mainframe box comprises a main shell, a pair of transverse partition plates is fixedly installed in the main shell through bolts, the interior of the main shell is divided into an air cavity, a middle containing cavity and a bottom containing cavity through the transverse partition plates from top to bottom, and a pair of vertical partition plates is fixedly installed between the transverse partition plates through bolts. The beneficial effects are that: internal equipment of the main shell is mounted in different areas through the bottom containing cavity, the middle containing cavity, the front containing cavity and the bottom containing cavity which are isolated from one another in the main shell; therefore, a fan is used for carrying out uniform partitioned cooling; in the cooling process, the air flow flowing path can be effectively controlled, coolingdead corners are avoided, the situation that main heat dissipation components bake other components can be effectively avoided, and therefore the heat dissipation effect is improved, the service lifeof the components is prolonged, the better dustproof effect is achieved, and maintenance and management of a computer are facilitated.

Description

technical field [0001] The invention relates to the technical field of computer equipment, in particular to a sub-area cooling computer mainframe box. Background technique [0002] The main computer case is the box used to install the main components of the computer. During the use of the computer, the internal heating parts will generate a lot of heat. The heat is generally dissipated by the CPU fan and the auxiliary cooling fan installed inside the case. However, these fans The wind force generated is generally relatively small, and when the chassis is relatively large, the airflow is easy to form a circulation in the chassis during the heat dissipation process, which makes it difficult to achieve a good heat dissipation effect in some areas, and because the hot air flow flows around, the surface of some accessory parts It also needs to endure high temperature baking, which is easy to cause the aging of these components, and the existing chassis also lacks a good dust-proo...

AI Technical Summary

Problems solved by technology

[0002] The main computer case is the box used to install the main components of the computer. During the use of the computer, the internal heating parts will generate a lot of heat. The heat is generally dissipated by the CPU fan and the auxiliary cooling fan installed inside the case. However, these fans The wind force generated is generally relatively small, and when the chassis is relatively large, the airflow is easy to form a circulation in the chassis during the heat dissipation process, which makes it difficult to achieve a good heat dissipation effect in some areas, and because the hot air flow flows around, the surface of some accessory parts It also needs to endure high temperature baking, which is easy to cause the aging of these components, and the existing chassis also lacks a good dust-proof design, so that frequent dust removal maintenance is required inside the chassis

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