Copper electroplating pin fixture residual copper treatment device and process

A processing device and a technology for electroplating copper, which can be used in electrolysis components, electrolysis processes, etc., and can solve problems such as tank liquid pollution, high nitrogen content in nitric acid waste liquid discharge, and potential safety hazards.

Inactive Publication Date: 2020-10-23
广德正大电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the residual copper of the electroplated copper pin fixture is treated by nitric acid micro-etching. Nitric acid is a strong oxidizing and corrosive acid, which has great safety hazards during use. The nitrogen content of the nitric acid waste liquid is high, and the waste liquid is not easy treatment, which pollutes the environment a lot, and the nitric acid solution is easily brought into the bath solution of the post-processing process, which is easy to cause bath solution pollution, resulting in product scrapping and a reduction in the service life of the bath solution
Moreover, the traditional nitric acid nitric acid etching has high requirements on temperature and environment, and the nitric acid etching method will increase with the increase of copper ions in the tank, and the etching ability will change, which is not conducive to the removal of residual copper on the hanger.

Method used

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  • Copper electroplating pin fixture residual copper treatment device and process
  • Copper electroplating pin fixture residual copper treatment device and process

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] see Figure 1~2 , the present invention provides a technical solution:

[0023] An electroplating copper pin fixture residual copper processing device, comprising a reaction pool 1, a pair of cathode plates 7 are arranged on the left and right side walls of the reaction pool 1, a placement frame 13 is arranged in the reaction pool 1, and the placement frame 13 A group of conductive clamps 16 are arranged on the top of the reaction tank 1, and a rectifi...

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Abstract

The invention discloses a copper electroplating pin fixture residual copper treatment device. The copper electroplating pin fixture residual copper treatment device comprises a reaction pool; a pair of cathode plates is arranged on the left and right side walls of the reaction pool; a placing frame is arranged in the reaction pool; one group of conductive chucks is arranged above the placing frame; a rectifier is arranged on the external side of the reaction pool; a cathode of the rectifier is connected with the cathode plate through a lead; an anode of the rectifier is connected with the conductive chucks through leads. A copper electroplating pin fixture residual copper treatment process comprises the steps of firstly, adding a solution, which is prepared by copper sulfate and sulfuric acid, to the reaction pool and clamping the conductive chucks on the fixture with residual copper; secondly, placing the fixture in the placing frame; and thirdly, enabling the rectifier to work to perform deplating. The copper electroplating pin fixture residual copper treatment device has the advantages of convenient operation, simple process, small pollution and good residual copper removing effect.

Description

technical field [0001] The invention relates to the technical field of residual copper processing devices, in particular to a residual copper processing device and process of an electroplated copper pin fixture. Background technique [0002] At present, the residual copper of the electroplated copper pin fixture is treated by nitric acid micro-etching. Nitric acid is a strong oxidizing and corrosive acid, which has great safety hazards during use. The nitrogen content of the nitric acid waste liquid is high, and the waste liquid is not easy The treatment is more polluting to the environment, and the nitric acid solution is easily brought into the bath solution of the post-processing process, which easily causes bath solution pollution, causes product scrapping and reduces the service life of the bath solution. Moreover, the traditional nitric acid nitric acid etching has high requirements on temperature and environment, and the nitric acid etching method will increase with t...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C25F5/00C25D17/08
CPCC25D17/08C25F5/00
Inventor刘烨
Owner广德正大电子科技有限公司