Disassembly device for sop packaged integrated circuit chip

Abstract

The invention discloses a dismantling device for an SOP packaged integrated circuit chip, which comprises a dismantling structure, a baking structure is arranged in the dismantling structure, a movable groove is arranged in the middle of the dismantling structure, a movable column is telescopic and movable connected in the movable groove, and the dismantling structure The bottom end is detachably connected with a limiting structure, and the top of the side walls on both sides where the detachable structures are far away from each other is connected with a filter structure. The high temperature is transmitted along the ventilation slots to heat the soldering point of the chip. After ensuring that the soldering point of the chip is melted, remove the disassembly structure from the circuit board through the handle, then turn off the fan and heating structure, and then push the movable column back In the movable slot, the gripper will gradually loosen along the torsion spring to remove the disassembled chip. The chip can be removed quickly through the disassembly structure, and the disassembly structure itself is relatively small and easy to operate.

Description

Technical field: [0001] The present invention belongs to the technical field of circuit chip disassembly equipment, and in particular, the present invention relates to a disassembly device for a SOP package integrated circuit chip. Background technique: [0002] The SOP package integrated circuit chip is an integrated chip mounted on the board. With many kinds of chip types similar to technology, this type of chip can be seen on the board, and this chip is installed on the board. It is possible to effectively improve the performance of the board, and the different chips can also be able to address the fields of different working environment and applications. [0003] Now that these chips are mostly soldered on the board, this leads to the current chip disassembly, and it is necessary to use special professional equipment to be removed, and the volume of these devices is generally relatively large, which leads to many Because of the damage of the chip, the entire board is discarde...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is just to provide a kind of dismantling device of SOP packaging integrated circuit chip in order to solve the above-mentioned problem, through baking structure and auxiliary structure, can effectively solve above-mentioned present these chips are mostly welded on the circuit board, This makes disassembly of the current chip more cumbersome and requires special professional equipment to be disassembled, and these devices are generally relatively large in size, which leads to many discarding the entire circuit board due to damage to the chip. Directly increase the production cost of production, and the directly discarded circuit boards will also have a certain negative impact on the surrounding environment.

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