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A high frequency copper clad laminate manufacturing process

A manufacturing process and copper clad laminate technology, applied in the field of high frequency copper clad laminate manufacturing process, can solve problems such as damage to the end face of copper clad laminate, difficulty in controlling strength, difficulty in collecting scraps, etc., to avoid damage, improve grinding efficiency, and reduce residual rate Effect

Active Publication Date: 2022-05-20
聚创(江门)新材料科技有限公司
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Problems solved by technology

[0004] In order to solve the above problems, the present invention provides a high-frequency copper-clad laminate manufacturing process, which can solve the problem that when sanding, due to the small edge surface of the copper-clad laminate, the sandpaper may come into contact with the upper and lower end surfaces of the copper-clad laminate, resulting in cladding. The end face of the copper plate is damaged, and it is difficult to control the strength of manual grinding, often there will be excessive grinding, and the scraps generated by grinding are difficult to collect, etc.

Method used

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  • A high frequency copper clad laminate manufacturing process
  • A high frequency copper clad laminate manufacturing process
  • A high frequency copper clad laminate manufacturing process

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Embodiment Construction

[0031] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0032] Such as Figure 1 to Figure 5 As shown, a high-frequency copper-clad laminate manufacturing process uses an auxiliary trimming device, which includes a base 1, a U-shaped frame 2, a pressing cylinder 3, a positioning block 4, a trimming unit 5, The driving unit 6 and the air suction unit 7 use the above-mentioned auxiliary trimming equipment to manufacture high-frequency copper-clad laminates as follows:

[0033] S1. Press forming: the adhesive is evenly poured on both sides of the base film, and the copper foil on both sides is pressed and combined with the base film by hot ...

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Abstract

The invention provides a high-frequency copper-clad laminate manufacturing process. The operation is completed by the cooperation of the base, U-shaped frame, downward pressure cylinder, positioning block, trimming unit, drive unit and air suction unit. The invention can solve the problem of sandpaper grinding due to The edge surface of the copper clad laminate is small, and the sandpaper may come into contact with the upper and lower end surfaces of the copper clad laminate, resulting in damage to the end surface of the copper clad laminate, and it is difficult to control the strength of manual grinding, and excessive grinding often occurs, and the grinding produces The scraps are difficult to collect and other problems.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad laminates, in particular to a manufacturing process for high-frequency copper-clad laminates. Background technique [0002] Copper-clad laminate, also known as the base material, is a plate-shaped material formed by impregnating the reinforcing material with resin, covering one or both sides with copper foil, and hot pressing, called copper-clad laminate. It is the basic material for PCB, often called substrate. When it is used in the production of multi-layer boards, it is also called core board. In the manufacturing process of copper clad laminates, adhesives are usually used to bond the aluminum foil to the substrate film and then pressed by hot pressing. After pressing, the excess glue The liquid will overflow and solidify on the edge of the copper clad laminate. People remove this overflowing glue by sanding. [0003] However, when sanding, due to the small edge surface of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/033B24B41/02B24B41/06B24B55/12B32B37/10
CPCB24B27/033B24B55/12B24B41/06B24B41/02B32B37/10
Inventor 洪宇豪
Owner 聚创(江门)新材料科技有限公司
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