The utility model relates to the technical field of
semiconductor packaging, and discloses a
semiconductor chip packaging glue dispenser with an anti-solidification function, which comprises a glue storage
barrel, the bottom end of the glue storage
barrel is hermetically communicated with a glue dispensing pump, the outlet end of the glue dispensing pump is connected with a glue conveying
pipe through a
flange, and one end, far away from the glue dispensing pump, of the glue conveying
pipe is connected with a glue dispensing head. According to the dispensing
machine with the anti-solidification function for
semiconductor chip packaging, efficient anti-sticking and precise
temperature control in the glue liquid conveying process are achieved through the synergistic effect of the
ceramic heating piece arranged on the inner wall of the glue conveying
pipe and the Teflon
coating, local overheating is avoided through the PTC self-temperature-limiting characteristic of the
ceramic heating piece, and by combining efficient heat preservation of the nano
aerogel felt, the anti-solidification function is achieved. The temperature fluctuation of the glue solution in the conveying process is effectively reduced, the residual rate of the glue solution is reduced due to the ultra-low
surface energy and mirror
surface smoothness of the Teflon
coating, the pipeline blockage risk caused by glue solution curing is remarkably reduced, and the stable operation of semiconductor
wafer packaging and dispensing is ensured.