A mobile terminal anti-hot melt overflow glue structure

A technology for mobile terminals and heat protection, applied in the structure of telephones, etc., can solve the problems of reduced hot-melt quality, half-blocked holes, nut-blocked holes, etc., and achieve the effect of improved hot-melt quality and reduced glue cleaning process

Active Publication Date: 2022-07-29
SHANGHAI MORUAN COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, after the nuts are melted in mobile terminals such as mobile phones, the casing will overflow with glue, which will cause the subsequent stations to fail to work normally. When the nuts on the market are melted, the softened plastic flows irregularly, causing the nuts to block or half-block the holes. The quality of hot melt is greatly reduced

Method used

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  • A mobile terminal anti-hot melt overflow glue structure
  • A mobile terminal anti-hot melt overflow glue structure
  • A mobile terminal anti-hot melt overflow glue structure

Examples

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Embodiment Construction

[0021] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this description of the present disclosure will be thorough and complete, and will consolidate the concept of the example embodiments. It will be fully conveyed to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted.

[0022] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided in order to give a thorough understa...

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Abstract

The invention discloses an anti-hot melt overflow glue structure of a mobile terminal, comprising a mobile phone front shell, and a first mobile phone front shell which is opened and communicated in sequence from the outer wall of the mobile phone front shell to the inner wall and along the thickness direction of the mobile phone front shell. A reserved groove, a hot melt groove, a second reserved groove and a connection groove are provided, and a fixing block is fixedly connected to one side of the inner wall surface of the front shell of the mobile phone. In the present invention, a stable groove is arranged on the outer wall of the fixed block, and the addition of the stable groove restricts the movement trajectory of the ejector rod. The addition of the fixed block prevents the disordered flow of plastic softened during hot melting from flowing into the space below the nut. According to the law of least resistance , the fluid flows in the direction of no resistance. The existence of the ejector rod and its cooperation with the nut make the plastic softened during hot melting flow along the ejector rod wall on the outside of the ejector rod. The addition of the ejector rod prevents the inside of the nut from being blocked. The addition of a reserved groove and a second reserved groove reduces the glue removal process after hole plugging.

Description

technical field [0001] The invention relates to the technical field of mobile terminals, in particular to an anti-hot melt adhesive overflow structure for a mobile terminal. Background technique [0002] A mobile terminal or a mobile communication terminal refers to a computer device that can be used on the move, broadly speaking, it includes a mobile phone, a notebook, a tablet computer, a POS machine, and even a vehicle-mounted computer. But in most cases, it refers to mobile phones or smartphones and tablets with multiple application functions. With the development of the network and technology in the direction of more and more broadband, the mobile communication industry will move towards the real mobile information age. On the other hand, with the rapid development of integrated circuit technology, the processing capability of the mobile terminal has already possessed a powerful processing capability, and the mobile terminal is changing from a simple communication tool...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/44H04M1/18
CPCB29C65/44H04M1/18
Inventor 李峰徐忠伟黄玉光
Owner SHANGHAI MORUAN COMM TECH
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