A mobile terminal anti-hot melt overflow glue structure
A technology for mobile terminals and heat protection, applied in the structure of telephones, etc., can solve the problems of reduced hot-melt quality, half-blocked holes, nut-blocked holes, etc., and achieve the effect of improved hot-melt quality and reduced glue cleaning process
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[0021] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this description of the present disclosure will be thorough and complete, and will consolidate the concept of the example embodiments. It will be fully conveyed to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted.
[0022] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided in order to give a thorough understa...
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