Integrated circuit test data analysis method and system

A technology for integrated circuits and test data, applied in the field of integrated circuit test data analysis methods and systems, and can solve problems such as poor accuracy and efficiency

CN112346920APending Publication Date: 2021-02-09ITEST SEMICON TECH JIANGSU CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2021-02-09

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Abstract

The invention provides an integrated circuit test data analysis method and system, and the method comprises the steps that a test machine analyzes the first test data of a tested first integrated circuit, and transmits the first test data to an analysis database; an analysis database receives and stores the first test data; an analysis device captures the first test data from the analysis databaseand calculates performance parameters of the first integrated circuit; the analysis device captures benchmark test data from the analysis database and calculates benchmark performance parameters, wherein the benchmark test data is m batches of test data before the first test data, the m batches of test data are adjacent in sequence, one batch of test data in the m batches of test data is adjacentto the first test data, and m is a positive integer; and the analysis device determines whether the first integrated circuit is a good product or not according to the performance parameters of the tested first integrated circuit and the benchmark performance parameters. According to the method, dynamic analysis of key indexes (yield, BIN class and the like) is realized, and the accuracy and efficiency of chip testing are improved.
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Description

technical field

[0001] The invention belongs to the field of chip testing, and in particular relates to an integrated circuit testing data analysis method and system. Background technique

[0002] Integrated circuits (chips) are widely used in various industries such as consumer electronics / security / industrial equipment / automotive electronics. All integrated circuit (chip) products must be strictly tested before they are finally assembled into products to ensure that they have the functions and quality of the design before they can be used. Integrated circuit testing includes two parts: wafer-level test (Wafer Test) before packaging and final test (Final Test) after packaging; integrated circuit manufacturing has complex multi-channel process flow, which will bring certain manufacturing failures (defective products) ), defective products need to be screened out and eliminated through wafer-level testing, and the packaging process is also complicated, which will also bring c...

Examples

Embodiment Construction

[0042] The present application will be further introduced below in conjunction with the accompanying drawings and embodiments.

[0043] In the following introduction, the terms "first" and "second" are only used for the purpose of description, and should not be understood as indicating or implying relative importance. The following description provides multiple embodiments of the present invention, and different embodiments can be replaced or combined in combination, so this application can also be considered to include all possible combinations of the same and / or different embodiments described. Thus, if one embodiment contains features A, B, C, and another embodiment contains features B, D, then the application should also be considered to include all other possible combinations containing one or more of A, B, C, D Although this embodiment may not be clearly written in the following content.

[0044] The following description provides examples, and does not limit the scope,...