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Cutting auxiliary device, cutting process of chip packaging structure and electronic device

A chip packaging structure and auxiliary device technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of colloidal particles on the surface of the product, to solve the problem of colloidal particles on the product, to ensure the appearance of the product, to improve The effect of yield

Active Publication Date: 2021-03-05
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to propose a cutting auxiliary device, a cutting method for a chip packaging structure, and an electronic device, aiming to solve the problem of colloidal particles on the surface of the product when the existing chip packaging structure is cut

Method used

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  • Cutting auxiliary device, cutting process of chip packaging structure and electronic device
  • Cutting auxiliary device, cutting process of chip packaging structure and electronic device
  • Cutting auxiliary device, cutting process of chip packaging structure and electronic device

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Embodiment Construction

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Those who do not indicate the specific conditions in the examples are carried out according to the conventional conditions or the conditions suggested by the manufacturer. The reagents or instruments used were not indicated by the manufacturer, and they were all conventional products that could be purchased from the market. In addition, the meaning of "and / or" appearing in the whole text includes three parallel schemes, taking "A and / or B" as an example, including scheme A, scheme B, or schemes that both A and B satisfy. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory ...

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Abstract

The invention discloses a cutting auxiliary device, a cutting process of a chip packaging structure and an electronic device, the cutting auxiliary device comprises a substrate, the substrate is provided with a first side surface and a second side surface which are oppositely arranged, the first side surface is used for fixedly installing a to-be-cut piece, and the first side surface is provided with a shading structure. The shading structure comprises a plurality of shading blocks arranged in a matrix mode, a light-transmitting channel allowing ultraviolet rays to penetrate through is formedbetween every two adjacent shading blocks at intervals, and the light-transmitting channels are used for being arranged corresponding to a cutting channel of the to-be-cut piece. At least the part, corresponding to the light-transmitting channel, of the substrate can allow ultraviolet rays to penetrate through. The invention provides an auxiliary cutting device applied to a chip packaging structure, and solves the problem that a product is provided with colloidal particles during cutting of an existing chip packaging structure, so that the appearance of the product is guaranteed, and the yieldis improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging structures, in particular to a cutting auxiliary device, a cutting method for chip packaging structures, and electronic devices. Background technique [0002] The rapid development of electronic products is the main driving force for the evolution of packaging technology today. Miniaturization, high density, high frequency and high speed, high performance, high reliability and low cost are the mainstream development directions of advanced packaging, among which System In a Package (System In a Package) , SIP package) is one of the most important and most potential technologies to meet this high-density system integration. [0003] In the actual packaging process of the chip, it is often unavoidable to involve the cutting process of the chip packaging structure. Usually, the chip and other electrical components are mounted on a carrier such as a substrate to form a piece to be cut, ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/67126
Inventor 于上家蒋忠华
Owner QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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