High performance refrigeration module with simple structure
A refrigeration module with a simple structure. It is applied in the direction of refrigerators, refrigeration and liquefaction, and the operation mode of machines. It can solve the problems of affecting heat transfer effects and reducing service life, so as to reduce excessive thermal resistance, prolong service life, Performance-enhancing effects
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[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0029] This embodiment provides a high-performance refrigeration module with a simple structure, such as figure 1 As shown, it includes a first radiator 1, a semiconductor cooling chip 2, a second radiator 3 and a thermally conductive glue 4. Two wires protrude from the bottom of the first radiator 1 for power supply. The first radiator 1 and the semiconductor cooling chip 2 The size is matched, the bottom area of the first radiator 1 is equal to the bottom area of the semiconductor cooling sheet 2, the bottom area of the second radiator 3 is greater than the bottom area of the semiconductor cooling sheet 2, and the semiconductor cooling sheet 2 is arranged between the first radiator 1 and the second cooling sheet Between the two radiators 3, thermally conductive glue 4 is arranged on both sides of the semiconductive cooling sheet 2 con...
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