Part replacement method
A component replacement and component technology, which is applied in the manufacturing of electrical components, conveyor objects, semiconductor/solid-state devices, etc., can solve the problems of longer downtime and time-consuming, and achieve the effect of shortening the downtime period.
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no. 1 approach
[0073] [Structure of processing system 10]
[0074] figure 1It is a system configuration diagram showing an example of the processing system 10 according to one embodiment of the present invention. In one embodiment, the processing system 10 includes a control device 20 , a plurality of processing assemblies 30 and a plurality of part handling devices 50 . The control device 20 is in communication with each processing module 30 and each part delivery device 50 , and controls each processing module 30 and each part delivery device 50 .
[0075] Each processing assembly 30 includes a vacuum delivery chamber 31 , a plurality of processing devices 40 - 1 to 40 - 6 , a plurality of load lock chambers 32 and an atmospheric delivery chamber 33 . In addition, below, when each of several processing apparatuses 40-1-40-6 is collectively called without distinction, it describes as the processing apparatus 40.
[0076] A plurality of processing devices 40 and a plurality of load lock c...
no. 2 approach
[0198] In the first embodiment, the exhaust device 554 is provided in the parts transfer device 50, and the gas in the parts transfer device 50 is exhausted to the outside of the parts transfer device 50 through the exhaust device 554, whereby the inside of the parts transfer device 50 is reduced. pressure. On the other hand, in the present embodiment, the gas in the component transport device 50 is exhausted through the exhaust system 46 of the process device 40 when the component transport device 50 is connected to the process device 40 . As a result, the exhaust device 554 is unnecessary in the component transport device 50 , and the component transport device 50 can be downsized. In addition, the system structure of the processing system 10 of this embodiment, and the use figure 1 The system configuration of the processing system 10 of the first embodiment described is the same, and therefore description thereof will be omitted.
[0199] [Structure of Processing Device 4...
no. 3 approach
[0214] The parts transfer device 50 in the first and second embodiments replaces the edge ring 423 which is one type of consumable part. On the other hand, the parts transfer device 50 of the present embodiment replaces a plurality of types of consumable parts. As several types of consumable parts, for example, the edge ring 423, the upper electrode 43e, and the like are conceivable.
[0215] The wafer cassette 52 accommodates consumable components before use and consumable components after use for a plurality of types of consumable components. In the present embodiment, a space for accommodating consumable components is defined for each type of consumable components in the wafer cassette 52 . Thereby, even when replacement of specific types of consumable parts is frequently performed, in the wafer cassette 52, reaction by-products and the like adhering to specific types of used consumable parts can be prevented from falling to other types of consumable parts. on the previous ...
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