Sound device and electronic device

A technology of sound-generating devices and electronic devices, which is applied in the direction of microphones, sensor parts, speaker shell brackets, etc., and can solve the problems of poor heat dissipation performance of speakers

Active Publication Date: 2021-09-14
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The main purpose of the present invention is to propose a sound-generating device and an e

Method used

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  • Sound device and electronic device
  • Sound device and electronic device
  • Sound device and electronic device

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses a sound production device and an electronic device. The sound production device comprises a shell, a sound production single body contained in the shell and a supporting plate arranged outside the shell, a rear cavity is formed between the sound production single body and the shell, and a heat dissipation channel is formed between the supporting plate and the shell; and the side, facing the shell, of the supporting plate is provided with a heat source, the heat source is located in the heat dissipation channel, the shell is provided with a heat dissipation window communicating with the rear cavity and the heat dissipation channel, and the heat dissipation window is covered with a heat dissipation vibrating diaphragm. When the sound production device is in use, the sound production monomer vibrates to enable the airflow in the rear cavity to generate oscillation, so that the heat dissipation diaphragm covering the heat dissipation window is impacted by the airflow in the rear cavity to generate oscillation, the vibration of the heat dissipation diaphragm generates oscillation airflow in the heat dissipation channel, forced convection is generated around the heat source, the heat source is quickly dissipated, the heat dissipation speed is increased, the heat dissipation efficiency and the heat dissipation performance are improved, and the high heat dissipation requirement is met.

Description

technical field [0001] The invention relates to the field of electroacoustic technology, in particular to a sound generating device and an electronic device. Background technique [0002] At present, electronic devices that use sound-generating devices, such as chips in speakers as the main heat source, usually conduct heat to the die-cast aluminum shell of the speaker box through a heat-conducting silica gel sheet, so as to dissipate heat through the high thermal conductivity of the shell itself, but , the thermal conductivity of the heat-conducting silicone sheet is small, the heat generated by the chip cannot be quickly transferred to the shell, and the heat transferred to the shell can only rely on the part of the shell itself exposed to the natural air for natural convection heat dissipation, the heat dissipation performance Poor, and with the increase of smart speaker functions, the demand for chip heat dissipation is also increasing, and the current heat dissipation m...

Claims

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Application Information

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IPC IPC(8): H04R1/02H05K7/20
CPCH04R1/028H04R1/021H04R1/026H05K7/20136H04R2201/02H04R2201/029
Inventor 王宇张志峰
Owner GOERTEK INC
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