Packaging structure, printed circuit board and electronic equipment

A technology of packaging structure and electronic components, applied in the direction of printed circuit, printed circuit, printed circuit components, etc., can solve the problems of impedance discontinuity, achieve the effect of improving impedance continuity, increasing impedance, and improving signal transmission effect
CN113692104APending Publication Date: 2021-11-23ZHEJIANG UNIVIEW TECH CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG UNIVIEW TECH CO LTD
Publication Date
2021-11-23

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Abstract

The invention discloses a packaging structure, a printed circuit board and electronic equipment. The packaging structure comprises a substrate, an electronic element and a bonding pad assembly, wherein the bonding pad assembly comprises a bonding pad body and a conductive body, the conductive body is arranged on the periphery of the bonding pad body, and the impedance of the bonding pad assembly is equal to preset impedance Z0; the electronic element is electrically connected with the bonding pad body, and the bonding pad body is connected with a signal line; the substrate comprises a conductive layer and a dielectric layer, the dielectric layer comprises a first dielectric layer, and the conductive layer comprises a first conductive layer; the bonding pad assembly and the signal line are arranged on the outer surface of the first dielectric layer, the first conductive layer is arranged on the side, which is away from the bonding pad assembly, of the first dielectric layer, the first dielectric layer is provided with a through hole, a conductive film is arranged on the inner surface of the through hole, and the conductive body is connected with the first conductive layer through the conductive film; and the conductive layer is provided with an opening structure, and the orthographic projection of the bonding pad body on the conductive layer is located in the opening structure. The packaging structure provided by the invention is beneficial to improving impedance continuity and improving a signal transmission effect.
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Description

technical field

[0001] The invention relates to the technical field of electronic devices, in particular to a packaging structure, a printed circuit board and electronic equipment. Background technique

[0002] In a high-speed serial link system, in order to increase the noise tolerance of the circuit, it is usually necessary to connect AC coupling capacitors at the signal input and signal output terminals, so as to improve the anti-interference ability of high-speed signals.

[0003] In a high-speed link, the impedance of the signal transmission path is negatively correlated with the width of the signal line. The larger the width of the signal line, the smaller the impedance of the signal transmission path. However, the width of the packaging pad of the AC coupling capacitor is much larger than the width of the signal line. Therefore, the impedance of the pad is smaller than the impedance of the signal line, which leads to the problem of discontinuous impedance at the pad o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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