Microswitch and preparation method thereof

A micro switch and switch technology, which is applied in the direction of electrical switches, contact parts manufacturing, and contact parts assembly/disassembly, etc., can solve the problem of easy failure resistance utilization rate of sliding switch devices, insufficient versatility of micro switches, and difficulty in assembling resistance, etc. problem, to avoid the difficulty of assembling resistance, avoid lack of versatility, and solve the effect of easy failure

Pending Publication Date: 2022-02-15
陆泳康
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a micro switch and its preparation method for the technical problems of insufficient versatility of the micro switch in the prior art, difficulty in assembling resistors, easy failure of the slide switch device, and low utilization rate of the resistor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microswitch and preparation method thereof
  • Microswitch and preparation method thereof
  • Microswitch and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033]In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0034] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counter...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a microswitch, characterized in that a COM terminal is arranged on a base; the COM terminal is provided with a clamping part and a first connecting part. The clamping part is arranged above the base; the lower end of the first connecting part penetrates out of the bottom of the base. The NO terminal is provided with a first bending part and a second connecting part; the first bending part is arranged above the base; the lower end of the second connecting part penetrates out of the bottom of the base. The NC terminal has a second bending part and a third connecting portion. The second bending part is arranged above the first bending part; the lower end of the third connecting part penetrates out of the bottom of the base. And the connecting terminal is connected to the bottom of the base below the second bending part. One end of the switching piece is connected with the clamping part, and the other end of the switching piece is arranged between the first bending part and the second bending part. And a plurality of resistors are connected between the first connecting part and the third connecting part. The technical problems of insufficient universality, low resistor utilization rate and the like in the prior art are solved.

Description

technical field [0001] The invention relates to the technical field of micro switches, in particular to a micro switch and a preparation method thereof. Background technique [0002] Micro switches are widely used in control equipment in various machinery, electronics, medical and other industries. According to the market research information, it can be seen that in addition to military fields such as aerospace, weaponry, and electronic communication equipment where high technology is concentrated, higher requirements are also placed on micro switch products in various civilian electrical fields. The micro switch product is not limited to a single switch function, and the market puts forward higher requirements such as miniaturization, high density, modularization and light weight. At present, domestic R&D and production of micro switch series products are in a state of fragmentation and disorder, and the product performance is low. Based on this, Chinese patent CN10511871...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01H13/02H01H13/10H01H13/12H01H13/14H01H1/58H01H9/02H01H11/00H01R43/16H01R43/24
CPCH01H13/02H01H13/10H01H1/58H01H9/0271H01H13/14H01H13/12H01H11/00H01R43/16H01R43/24
Inventor 陆泳康李边江
Owner 陆泳康
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap