A mt29f series nand FLASH test burn-in system with a customizable process

Abstract

An MT29F series NAND FLASH test aging system with a customizable process comprises an upper computer, a program control power source, a high temperature test box, a USB-to-UART bridge, and a lower computer. The lower computer comprises N motherboards with a same structure, M signal boards with a same structure, and K DUT boards with a same structure. Multiple signal boards are mounted on each motherboard in the lower computer, and one DUT board is mounted on each signal board. The motherboard comprises a power source interface, a UART interface, multiple connectors docking with the signal board, and multiple signal board identity setting circuit docking with the signal board. The signal board comprises an FPGA used as a test controller and an auxiliary circuit thereof, and also comprises a connector docking with the motherboard and a connector docking with the DUT board. The DUT board comprises multiple high-temperature resistant test clippers and a connector docking with the signal board.

Description

technical field [0001] The invention relates to an MT29F series NAND FLASH test burn-in system with a process that can be customized. Background technique [0002] Micron's MT29F series NAND FLASH adopts SLC architecture design and is compatible with ONFI interface. The single-chip capacity ranges from 32Gbit to 256Gbit, and the quality grades include commercial and industrial grades. A series of reliability screening and assessment tests are required before low-grade NAND FLASH is used in aerospace models. The tests related to the electrical characteristics of the device mainly include: functional test, dynamic burn-in, static burn-in, steady-state life, erasing life and data retention etc. Although the conditions of each test are different, from the bottom layer, they all perform basic operations on NAND FLASH, such as erasing / writing / reading. The existing NAND FLASH testing aging system has the following problems: [0003] (1) Single function [0004] Various electric...

AI Technical Summary

Problems solved by technology

[0005] (2) The same test ability is limited

Taking the 128Gbit model product with 36 signal pins in the MT29F series as an example, an ATE equipped with 256 test channels can only test 7 devices at the same time, and hardware expansion will bring huge costs

[0007] (3) Insufficient versatility

[0008] Existing burn-in systems for NAND FLASH are usually dedicated systems, that is, burn-in tests can only be performed on a specific type of NAND FLASH device

[0009] (4) Insufficient effectiveness of aging

The advantage of this architecture is that it effectively reduces the number of burn-in signals, but the disadvantage is that it limits the transmission frequency of burn-in signals and reduces the effectiveness of dynamic burn-in tests (failure to keep all devices in working condition all the time)

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