Directional high-heat-conduction electronic module box body and heat conduction design method

A technology of electronic modules and design methods, applied in the direction of modification by conduction and heat transfer, electrical equipment shell/cabinet/drawer, electrical components, etc., can solve the problem of unsolved directional heat conduction, etc. Effects of internal media

Active Publication Date: 2022-03-01
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing patents, the problem of directional heat conduction is not solved

Method used

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  • Directional high-heat-conduction electronic module box body and heat conduction design method
  • Directional high-heat-conduction electronic module box body and heat conduction design method
  • Directional high-heat-conduction electronic module box body and heat conduction design method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Embodiment 1: as figure 1 , figure 2 , image 3 As shown, a directional high thermal conductivity electronic module box body includes a metal substrate 1, a high thermal conductivity plate 2 and a metal cover plate 3; One side is used for mounting printed boards or electronic components.

Embodiment 2

[0039] Embodiment 2: on the basis of embodiment 1, as Figure 4As shown, the side of the metal substrate 1 where the high thermal conductivity plate 2 is installed is defined as the back cavity, and ribs 101 are provided in the back cavity to achieve targeted heat isolation and directional transfer of heat; and, the high thermal conductivity plate 2 is installed In the back cavity of the metal base 1 , it is sealed with a metal cover 3 . In this embodiment, in actual implementation, the back cavity is further provided with a heat conducting material installation cavity 102 , a metal cover installation surface 103 and a heat sink surface 104 .

Embodiment 3

[0040] Embodiment 3: on the basis of embodiment 1, as Figure 5 As shown, the side of the metal substrate 1 where printed boards or electronic components are installed is defined as a front cavity, and the specific structural features of the front cavity can be set according to the layout of internal electronic devices. In this embodiment, during actual implementation, the front cavity is further provided with a device cooling boss 105 , a printed board mounting surface 106 , and a box body cover mounting surface 107 .

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Abstract

The invention discloses a directional high-thermal-conductivity electronic module box body and a thermal conduction design method, and belongs to the technical field of electronic equipment heat dissipation, and the directional high-thermal-conductivity electronic module box body comprises a metal substrate, a high-thermal-conductivity plate and a metal cover plate; the metal substrate is a structural member with two slotted surfaces, one side is used for installing a high-thermal-conductivity plate, and the other side is used for installing a printed board or an electronic assembly. According to the invention, the non-metal light high-thermal-conductivity material is packaged in the metal structure body with the inner cavity, the directional high-thermal-conductivity function of the structure box body is realized through layout design, and the structure box body has the advantages of high reliability, good thermal conductivity, simple structure, low density, economy, feasibility and the like.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, and more specifically, relates to a directional high thermal conductivity electronic module box and a heat conduction design method. Background technique [0002] With the development of high integration of electronic equipment, the heat consumption of a single module is increasing day by day. In the case of constant heat dissipation resources, the thermal conductivity of the electronic module structure will directly affect the junction temperature of the chip, so it is very important to improve the thermal conductivity of the module structure. The traditional electronic module box is usually made of aluminum alloy, and the thermal conductivity is about 120-170W / (m·K). At present, commonly used thermal conductivity enhancement technologies mainly include phase change vapor chambers and high thermal conductivity composite metal materials. Among them, the former t...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K7/20H05K5/02H05K5/03H05K5/04H05K5/06H05K7/14
CPCH05K7/2039H05K5/04H05K5/0217H05K5/03H05K5/0004H05K5/06H05K7/14
Inventor刘芬芬程皓月尹本浩叶元鹏褚鑫阳凯王浩儒白宗旭
OwnerSOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP