Fan-out type packaging structure and packaging method

Abstract

The invention provides a fan-out packaging structure and a packaging method. The fan-out packaging structure comprises a first rewiring layer, a second rewiring layer, a metal connecting column, a semiconductor chip, a first filling layer, a first packaging layer, a stacked chip packaging body, a passive element, a second filling layer, a second packaging layer and a metal bump. According to the fan-out packaging structure, various chips with different functions can be integrated in one packaging structure, so that the integration of the fan-out packaging structure can be improved; through the first rewiring layer, the second rewiring layer and the metal connecting columns, three-dimensional vertical stacking packaging is achieved, the integration level of the packaging structure can be effectively improved, the conduction path can be effectively shortened, power consumption is reduced, the transmission speed is increased, and the data processing amount is increased.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a fan-out packaging structure and packaging method. Background technique [0002] Lower cost, more reliable, faster and higher density circuits are the goals pursued by integrated circuit packaging. With the advent of the era of 5G communication and artificial intelligence, chips used in such related fields need to transmit and process high-speed interactive processing with a large amount of data, and the demand for mobile Internet and Internet of Things is becoming stronger and stronger, and the small size of electronic terminal products Globalization and multi-functionalization have become the general trend of industrial development. How to integrate and package different types of high-density chips together to form a system with powerful functions and low volume and power consumption has become a major challenge in the field of advanced packaging of semiconduc...

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a fan-out packaging structure and packaging method, which are used to solve the problems in the prior art that the packaging volume is difficult to reduce and the packaging integration level is low.

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