Manufacturing method of flexible circuit board and processing method of flexible material

A technology of flexible circuit boards and flexible materials, which is applied in chemical/electrolytic methods to remove conductive materials and secondary processing of printed circuits, etc. The effect of reducing the production cost, overcoming the machining accuracy, and saving the procurement cost

Pending Publication Date: 2022-04-12
武汉铱科赛科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a method for manufacturing a flexible circuit board and a method for processing flexible materials. The method for manufacturing a flexible circuit board can reduce the plasma cleaning and micro-etching processes of the traditional flexible circuit board manufacturing process, and can also directly Reduce the material cost of FCCL; the processing method of flexible materials can solve the problem that when the flexible material is processed, the tensile deformation of the flexible material is directly caused by the tensile force, resulting in the loss of processing accuracy, and the unwinding and rewinding of the material cannot be carried out without tension

Method used

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  • Manufacturing method of flexible circuit board and processing method of flexible material
  • Manufacturing method of flexible circuit board and processing method of flexible material
  • Manufacturing method of flexible circuit board and processing method of flexible material

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Experimental program
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Effect test

Embodiment 1

[0030] like figure 1 Shown, a kind of manufacturing method of flexible circuit board comprises the following steps,

[0031] S1, image file processing is performed on the flexible material to form a flexible material with processed graphics;

[0032] S2, sputtering and electroplating the flexible material with the processed pattern to form a flexible copper clad laminate;

[0033] S3, etching circuits on the flexible copper clad laminate to form a flexible circuit board.

[0034] In the production process of flexible circuit boards, flexible copper clad laminates (Flexible Copper Clad Laminate, FCCL, also known as: flexible copper clad laminates) are used as the processing substrate materials of flexible printed circuit boards (Flexible Printed Circuit board, FPC). FCCL is composed of flexible insulating base film and metal foil. The flexible copper-clad laminate composed of three different materials, copper foil, film and adhesive, is called a three-layer flexible copper-c...

Embodiment 2

[0050] like figure 2 As shown, a processing method for flexible materials, image file processing of flexible materials, including the following steps,

[0051] determining the original processing image file of the flexible material to be processed, and stretching and deforming the original processing image file to obtain a precision compensation processing image file;

[0052] Carry out image processing on the flexible material subjected to tension according to the accuracy compensation processing image, so as to form a processing pattern on the flexible material subjected to tension, and after unloading the tension on the flexible material, The processing pattern on the flexible material without tension is matched with the theoretical pattern of the original processing pattern.

[0053] The matching refers to the obtained processing graphics and theoretical processing graphics, which meet the design accuracy requirements.

[0054] In some cases, flexible materials require ...

Embodiment 3

[0085] Based on the above-mentioned flexible material processing method, the present invention also provides a flexible material processing system.

[0086] like image 3 As shown, a flexible material processing system includes the following modules,

[0087] A processing image compensation module, which is used to determine the original processing image of the flexible material, and stretch and deform the original processing image to obtain a precision compensation processing image;

[0088] The image file processing module is used to process the image file of the flexible material subjected to tension according to the accuracy compensation processing image file, so as to form a processing image on the flexible material subjected to tension force, and unload the After the flexible material is subjected to tension, the processing pattern on the flexible material not subject to tension matches the theoretical pattern of the original processing image file.

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Abstract

The invention relates to the field of flexible material precision machining, in particular to a manufacturing method of a flexible circuit board and a machining method of a flexible material.The machining method of the flexible material comprises the following steps that an original machining drawing file of the flexible material to be machined is determined, and stretching deformation is conducted on the original machining drawing file to obtain a precision compensation machining drawing file; according to the precision compensation processing drawing file, drawing file processing is carried out on the flexible material subjected to the pulling force effect, so that a processing graph is formed on the flexible material subjected to the pulling force effect, and after the pulling force borne by the flexible material is unloaded, the flexible material is subjected to drawing file processing; and the processing pattern on the flexible material which is not subjected to the pulling force is matched with the theoretical pattern of the original processing drawing file. The processing method of the flexible material can solve the problems that the processing precision is lost due to the fact that the flexible material is directly subjected to tensile deformation due to tensile force when the flexible roll material is processed, and roll material unwinding and roll material winding cannot be carried out due to the fact that the flexible material is not subjected to tensile force.

Description

technical field [0001] The invention relates to the technical field of precision processing of flexible materials, in particular to a method for manufacturing a flexible circuit board and a method for processing flexible materials. Background technique [0002] At present, flexible circuit boards are mainly produced by FCCL for mechanical or laser drilling and etching and electroplating. Whether it is electrolytic copper or rolled copper, the production cost is relatively high. [0003] If you directly drill holes on the PI film (polyimide), then sputter the electroplating seed layer, then electroplate the copper foil, and then directly etch the circuit, you can reduce the plasma cleaning and micro-etching in the traditional flexible circuit board process. The process can also directly reduce the material cost of FCCL. However, if only a single sheet is produced, it is difficult to automate production and thus cannot significantly reduce costs. [0004] If the roll-to-roll...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K3/06H05K3/22
Inventor张立国
Owner武汉铱科赛科技有限公司