Wafer transfer control method and device, wafer transfer system and readable storage medium
A control method and wafer transfer technology, applied in the fields of wafer transfer systems, computer-readable storage media, devices, and wafer transfer control methods, can solve problems such as affecting detection efficiency, reducing production capacity, and wasting time. Achieve the effect of reducing pollution, reducing wear, reducing the number of pumping and deflation
Pending Publication Date: 2022-07-22
DONGFANG JINGYUAN ELECTRON LTD
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
A lot of time is wasted during the transfer process, and the wafer inspection equipment is in a waiting state for a long time, which seriously affects the inspection efficiency and reduces the production capacity
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0112] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. It will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating examples of the present application.
[0113]It should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from ano...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a wafer transfer control method and device, a wafer transfer system and a computer readable storage medium. The wafer transfer control method is applied to the wafer transfer system, the wafer transfer system comprises a semiconductor equipment front-end module, a wafer pre-pumping device and a main detection module which are sequentially connected in series, a valve is arranged between every two adjacent modules, and a wafer transfer device used for bearing wafers is arranged in the wafer pre-pumping device. The method comprises the steps that the wafer conveying device continuously receives at least two wafers; under the condition that a first valve between the semiconductor equipment front-end module and the wafer pre-pumping device is closed, performing air pumping operation on the wafer pre-pumping device until the air pressure in the wafer pre-pumping device reaches a preset first air pressure threshold value; and under the condition that the second valve between the wafer pre-pumping device and the main detection module is opened, the at least two wafers are sequentially conveyed into the main detection module to be detected. According to the embodiment of the invention, the wafer transfer efficiency can be improved, and the productivity is further improved.
Description
technical field [0001] The present application belongs to the field of wafer transfer control, and in particular relates to a wafer transfer control method, device, wafer transfer system and computer-readable storage medium. Background technique [0002] In the process of chip production, wafer inspection is a crucial link. When inspecting wafers, a wafer transfer system is required to transfer the wafers to the inspection station of the wafer inspection equipment. , also known as the transfer process. [0003] In the traditional wafer transfer system, the single-wire serial transfer control mode is adopted when the wafer passes through the important wafer pre-loading cavity (loadlock), that is, the wafer can only be transferred serially one by one: [0004] figure 1 Shown is a schematic structural diagram of a wafer transfer system in the prior art. Robot A in a semiconductor equipment front-end module (EFEM) will grab a wafer from a front-opening wafer transfer box (FOUP...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/683
CPCH01L21/67276H01L21/6838H01L21/67706H01L21/67736
Inventor 张刚
Owner DONGFANG JINGYUAN ELECTRON LTD